E.B. Liao
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced MEMS and NEMS Technologies
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- 3D IC and TSV technologies 18
- Electronic Packaging and Soldering Technologies 15
- Semiconductor materials and devices 9
- Advanced MEMS and NEMS Technologies 6
- Photonic and Optical Devices 3
- Electromagnetic Compatibility and Noise Suppression 3
- Co-authors
- R. Nagarajan (8 shared papers)V. Kripesh (12 shared papers)John H. Lau (3 shared papers)Xiaowu Zhang (3 shared papers)T.C. Chai (2 shared papers)H.Y. Li (9 shared papers)Navas Khan (2 shared papers)Levent Yobaş (1 shared paper)
- Journals
- IEEE Electron Device Letters (3 papers)IEEE Transactions on Electron Devices (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)IEEE Transactions on Advanced Packaging (2 papers)Electronics Letters (1 paper)
- Partner nations
- SingaporeUnited StatesTaiwan
In The Last Decade
E.B. Liao
34 papers receiving 506 citations
Peers
Comparison fields: 5 of 40
- Electrical and Electronic Engineering 470
- Automotive Engineering 80
- Biomedical Engineering 157
- Electronic, Optical and Magnetic Materials 39
- Hardware and Architecture 9
Countries citing papers authored by E.B. Liao
This map shows the geographic impact of E.B. Liao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E.B. Liao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E.B. Liao more than expected).
Fields of papers citing papers by E.B. Liao
This network shows the impact of papers produced by E.B. Liao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E.B. Liao. The network helps show where E.B. Liao may publish in the future.
Co-authors
The 25 scholars most cited alongside E.B. Liao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 95 | |
| 2 | 2009 | 90 | |
| 3 | 2006 | 58 | |
| 4 | 2011 | 36 | |
| 5 | 2020 | 34 | |
| 6 | TSV process optimization for reduced device impact on 28nm CMOS | 2011 | 24 |
| 7 | 2010 | 22 | |
| 8 | 2024 | 17 | |
| 9 | 2006 | 17 | |
| 10 | 2010 | 17 | |
| 11 | 2010 | 17 | |
| 12 | 2005 | 15 | |
| 13 | 2006 | 13 | |
| 14 | 2006 | 13 | |
| 15 | 2006 | 8 | |
| 16 | 2008 | 7 | |
| 17 | 2008 | 7 | |
| 18 | 2008 | 5 | |
| 19 | 2005 | 4 | |
| 20 | 2007 | 4 |
About E.B. Liao
E.B. Liao is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Bioengineering and Automotive Engineering, having authored 36 papers that have together received 536 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (15 papers), Semiconductor materials and devices (9 papers), Advanced MEMS and NEMS Technologies (6 papers), Photonic and Optical Devices (3 papers), Modular Robots and Swarm Intelligence (3 papers), Electromagnetic Compatibility and Noise Suppression (3 papers) and Analytical Chemistry and Sensors (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (470 citations), Automotive Engineering (80 citations), Biomedical Engineering (157 citations), Electronic, Optical and Magnetic Materials (39 citations) and Hardware and Architecture (9 citations). E.B. Liao has collaborated with scholars based in Singapore, United States and Taiwan. Frequent co-authors include R. Nagarajan, V. Kripesh, John H. Lau, Xiaowu Zhang, T.C. Chai, H.Y. Li, Navas Khan, Levent Yobaş, Wee‐Liat Ong and Ajay Agarwal. Their work appears in journals such as IEEE Electron Device Letters, IEEE Transactions on Electron Devices, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Advanced Packaging and Electronics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.