M. J. Wolf
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 30
- Electronic Packaging and Soldering Technologies 21
- Electrodeposition and Electroless Coatings 4
- Semiconductor materials and devices 4
- Integrated Circuits and Semiconductor Failure Analysis 4
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- Advanced Surface Polishing Techniques 6
- Co-authors
- H. Reichl (12 shared papers)Bernhard Wunderle (9 shared papers)Armin Klumpp (3 shared papers)Peter Ramm (2 shared papers)Kai Zoschke (7 shared papers)O. Ehrmann (6 shared papers)Robert Wieland (2 shared papers)B. Michel (1 shared paper)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Journal of Manufacturing and Materials Processing (2 papers)Microelectronic Engineering (2 papers)Solar Energy Materials and Solar Cells (1 paper)IEEE Transactions on Advanced Packaging (1 paper)
- Partner nations
- GermanySwitzerlandNetherlands
In The Last Decade
M. J. Wolf
39 papers receiving 579 citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 540
- Automotive Engineering 82
- Biomedical Engineering 126
- Electronic, Optical and Magnetic Materials 49
- Renewable Energy, Sustainability and the Environment 39
Countries citing papers authored by M. J. Wolf
This map shows the geographic impact of M. J. Wolf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. J. Wolf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. J. Wolf more than expected).
Fields of papers citing papers by M. J. Wolf
This network shows the impact of papers produced by M. J. Wolf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. J. Wolf. The network helps show where M. J. Wolf may publish in the future.
Co-authors
The 25 scholars most cited alongside M. J. Wolf, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 41 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 90 | |
| 2 | 2008 | 90 | |
| 3 | 2013 | 64 | |
| 4 | 2007 | 44 | |
| 5 | 1999 | 42 | |
| 6 | 2008 | 33 | |
| 7 | 2010 | 28 | |
| 8 | 2018 | 20 | |
| 9 | 2009 | 16 | |
| 10 | 2015 | 14 | |
| 11 | 2015 | 14 | |
| 12 | 2021 | 14 | |
| 13 | 2020 | 13 | |
| 14 | 2014 | 12 | |
| 15 | 2012 | 12 | |
| 16 | 2009 | 11 | |
| 17 | 2018 | 10 | |
| 18 | 2005 | 8 | |
| 19 | 2018 | 8 | |
| 20 | 2004 | 7 |
About M. J. Wolf
M. J. Wolf is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials and Bioengineering, having authored 41 papers that have together received 606 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (21 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Copper Interconnects and Reliability (6 papers), Advanced Surface Polishing Techniques (6 papers), Electrodeposition and Electroless Coatings (4 papers), Semiconductor materials and devices (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (540 citations), Automotive Engineering (82 citations), Biomedical Engineering (126 citations), Electronic, Optical and Magnetic Materials (49 citations) and Renewable Energy, Sustainability and the Environment (39 citations). M. J. Wolf has collaborated with scholars based in Germany, Switzerland and Netherlands. Frequent co-authors include H. Reichl, Bernhard Wunderle, Armin Klumpp, Peter Ramm, Kai Zoschke, O. Ehrmann, Robert Wieland, B. Michel, Nils Jürgensen and Jacques‐E. Moser. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Manufacturing and Materials Processing, Microelectronic Engineering, Solar Energy Materials and Solar Cells and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.