K. Soejima
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 12
- Electronic Packaging and Soldering Technologies 10
- Semiconductor Lasers and Optical Devices 5
- Silicon Carbide Semiconductor Technologies 2
- Advancements in Semiconductor Devices and Circuit Design 2
- Semiconductor materials and devices 2
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- Nanofabrication and Lithography Techniques 4
- Analog and Mixed-Signal Circuit Design 2
- Co-authors
- Yoichiro Kurita (9 shared papers)S. Matsui (5 shared papers)Nobuaki Takahashi (4 shared papers)Masahiro Komuro (4 shared papers)M. Kawano (5 shared papers)Masaya Kawano (5 shared papers)Hidekazu Kikuchi (2 shared papers)Osamu Kato (2 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (1 paper)IEICE Transactions on Electronics (1 paper)Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms (1 paper)IEEE Transactions on Electron Devices (1 paper)IEEE Journal of Solid-State Circuits (1 paper)
- Partner nations
- JapanSouth Korea
In The Last Decade
K. Soejima
16 papers receiving 266 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 273
- Automotive Engineering 33
- Hardware and Architecture 14
- Electronic, Optical and Magnetic Materials 30
- Mechanics of Materials 27
Countries citing papers authored by K. Soejima
This map shows the geographic impact of K. Soejima's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. Soejima with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. Soejima more than expected).
Fields of papers citing papers by K. Soejima
This network shows the impact of papers produced by K. Soejima. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. Soejima. The network helps show where K. Soejima may publish in the future.
Co-authors
The 25 scholars most cited alongside K. Soejima, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 61 | |
| 2 | 2006 | 59 | |
| 3 | 2007 | 53 | |
| 4 | 2009 | 36 | |
| 5 | 2006 | 30 | |
| 6 | 2011 | 17 | |
| 7 | 2003 | 8 | |
| 8 | 2009 | 8 | |
| 9 | 2009 | 6 | |
| 10 | 2004 | 5 | |
| 11 | 2008 | 5 | |
| 12 | 2009 | 3 | |
| 13 | 1990 | 3 | |
| 14 | 1989 | 2 | |
| 15 | 2007 | 1 | |
| 16 | 2009 | 1 |
About K. Soejima
K. Soejima is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanics of Materials, Automotive Engineering and Mechanical Engineering, having authored 16 papers that have together received 298 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (10 papers), Semiconductor Lasers and Optical Devices (5 papers), Nanofabrication and Lithography Techniques (4 papers), Silicon Carbide Semiconductor Technologies (2 papers), Advancements in Semiconductor Devices and Circuit Design (2 papers), Semiconductor materials and devices (2 papers) and Analog and Mixed-Signal Circuit Design (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (273 citations), Automotive Engineering (33 citations), Hardware and Architecture (14 citations), Electronic, Optical and Magnetic Materials (30 citations) and Mechanics of Materials (27 citations). K. Soejima has collaborated with scholars based in Japan and South Korea. Frequent co-authors include Yoichiro Kurita, S. Matsui, Nobuaki Takahashi, Masahiro Komuro, M. Kawano, Masaya Kawano, Hidekazu Kikuchi, Osamu Kato, Hiroaki Ikeda and Junji Yamada. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEICE Transactions on Electronics, Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms, IEEE Transactions on Electron Devices and IEEE Journal of Solid-State Circuits.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.