Bernhard Rebhan
Impact in
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- Additive Manufacturing and 3D Printing Technologies
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advanced MEMS and NEMS Technologies
Papers in
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- 3D IC and TSV technologies 26
- Electronic Packaging and Soldering Technologies 21
- Silicon and Solar Cell Technologies 1
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- Additive Manufacturing and 3D Printing Technologies 7
- Co-authors
- Kurt Hingerl (7 shared papers)Viorel Drăgoi (18 shared papers)Günter Hesser (2 shared papers)Markus Wimplinger (4 shared papers)Sajjad Tollabimazraehno (2 shared papers)Jiri Duchoslav (2 shared papers)Andreas Hinterreiter (2 shared papers)S. Lhostis (2 shared papers)
In The Last Decade
Bernhard Rebhan
25 papers receiving 236 citations
Peers
Comparison fields: 5 of 24
- Automotive Engineering 51
- Electrical and Electronic Engineering 213
- Electronic, Optical and Magnetic Materials 65
- Mechanical Engineering 38
- Biomedical Engineering 36
Countries citing papers authored by Bernhard Rebhan
This map shows the geographic impact of Bernhard Rebhan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bernhard Rebhan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bernhard Rebhan more than expected).
Fields of papers citing papers by Bernhard Rebhan
This network shows the impact of papers produced by Bernhard Rebhan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bernhard Rebhan. The network helps show where Bernhard Rebhan may publish in the future.
Co-authors
The 25 scholars most cited alongside Bernhard Rebhan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 67 | |
| 2 | 2013 | 30 | |
| 3 | 2018 | 19 | |
| 4 | 2015 | 17 | |
| 5 | 2015 | 16 | |
| 6 | 2016 | 12 | |
| 7 | 2014 | 12 | |
| 8 | 2016 | 10 | |
| 9 | 2017 | 10 | |
| 10 | 2017 | 8 | |
| 11 | 2019 | 8 | |
| 12 | 2014 | 6 | |
| 13 | 2019 | 6 | |
| 14 | 2018 | 4 | |
| 15 | 2015 | 4 | |
| 16 | 2023 | 2 | |
| 17 | 2020 | 2 | |
| 18 | 2020 | 2 | |
| 19 | 2014 | 2 | |
| 20 | 2017 | 2 |
About Bernhard Rebhan
Bernhard Rebhan is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering, having authored 27 papers that have together received 245 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (21 papers), Additive Manufacturing and 3D Printing Technologies (7 papers), Advanced Surface Polishing Techniques (6 papers), Copper Interconnects and Reliability (5 papers), Advanced Welding Techniques Analysis (2 papers), Advanced ceramic materials synthesis (2 papers) and Silicon and Solar Cell Technologies (1 paper). The work is most often cited by research in Automotive Engineering (51 citations), Electrical and Electronic Engineering (213 citations), Electronic, Optical and Magnetic Materials (65 citations), Mechanical Engineering (38 citations) and Biomedical Engineering (36 citations). Bernhard Rebhan has collaborated with scholars based in Austria, Germany and Norway. Frequent co-authors include Kurt Hingerl, Viorel Drăgoi, Günter Hesser, Markus Wimplinger, Sajjad Tollabimazraehno, Jiri Duchoslav, Andreas Hinterreiter, S. Lhostis, Jiří Svoboda and M. Kawano. Their work appears in journals such as Microsystem Technologies, Microelectronics Reliability, ECS Transactions, Journal of Applied Physics and ECS Journal of Solid State Science and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.