P. McLaughlin
Impact in
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- Copper Interconnects and Reliability
- Equine top 5%
Papers in
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- Semiconductor materials and devices 26
- Electronic Packaging and Soldering Technologies 13
- Integrated Circuits and Semiconductor Failure Analysis 5
- 3D IC and TSV technologies 2
- Electrodeposition and Electroless Coatings 2
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- Copper Interconnects and Reliability 26
- Co-authors
- Tarıq Samad (2 shared papers)F. Chen (4 shared papers)J. R. Lloyd (3 shared papers)Kaushik Chanda (3 shared papers)J. Gill (4 shared papers)T. Sullivan (1 shared paper)J. Aitken (2 shared papers)C E Doige (1 shared paper)
- Journals
- IEEE Transactions on Device and Materials Reliability (3 papers)IEEE Electron Device Letters (1 paper)Journal of Process Control (1 paper)Applied Physics Letters (1 paper)ECS Transactions (1 paper)
- Partner nations
- United StatesGermanyIndia
In The Last Decade
P. McLaughlin
30 papers receiving 506 citations
Peers
Comparison fields: 5 of 65
- Electronic, Optical and Magnetic Materials 324
- Equine 27
- Electrical and Electronic Engineering 429
- Hardware and Architecture 24
- Control and Systems Engineering 51
Countries citing papers authored by P. McLaughlin
This map shows the geographic impact of P. McLaughlin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. McLaughlin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. McLaughlin more than expected).
Fields of papers citing papers by P. McLaughlin
This network shows the impact of papers produced by P. McLaughlin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. McLaughlin. The network helps show where P. McLaughlin may publish in the future.
Co-authors
The 25 scholars most cited alongside P. McLaughlin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 32 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 131 | |
| 2 | 2007 | 69 | |
| 3 | 2008 | 40 | |
| 4 | 2016 | 39 | |
| 5 | Thyroid hormone levels in foals with congenital musculoskeletal lesions. | 1986 | 38 |
| 6 | 2007 | 31 | |
| 7 | 2010 | 23 | |
| 8 | 2005 | 21 | |
| 9 | 2018 | 21 | |
| 10 | 2009 | 20 | |
| 11 | 2009 | 14 | |
| 12 | 2016 | 13 | |
| 13 | 2017 | 12 | |
| 14 | 2015 | 12 | |
| 15 | 2017 | 12 | |
| 16 | 2014 | 11 | |
| 17 | 2007 | 5 | |
| 18 | 2017 | 5 | |
| 19 | 2018 | 5 | |
| 20 | 2011 | 5 |
About P. McLaughlin
P. McLaughlin is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Materials Chemistry and Industrial and Manufacturing Engineering, having authored 32 papers that have together received 550 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (26 papers), Semiconductor materials and devices (26 papers), Electronic Packaging and Soldering Technologies (13 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Metal and Thin Film Mechanics (2 papers), Flexible and Reconfigurable Manufacturing Systems (2 papers), 3D IC and TSV technologies (2 papers) and Electrodeposition and Electroless Coatings (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (324 citations), Equine (27 citations), Electrical and Electronic Engineering (429 citations), Hardware and Architecture (24 citations) and Control and Systems Engineering (51 citations). P. McLaughlin has collaborated with scholars based in United States, Germany and India. Frequent co-authors include Tarıq Samad, F. Chen, J. R. Lloyd, Kaushik Chanda, J. Gill, T. Sullivan, J. Aitken, C E Doige, Bruce G. McLaughlin and J. Demarest. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, IEEE Electron Device Letters, Journal of Process Control, Applied Physics Letters and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.