C. Penny
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- 3D IC and TSV technologies
- Low-power high-performance VLSI design
- Electronic Packaging and Soldering Technologies
- Electrodeposition and Electroless Coatings
Papers in
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- Semiconductor materials and devices 5
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- Copper Interconnects and Reliability 6
- Co-authors
- Nicholas A. Lanzillo (2 shared papers)K. Motoyama (2 shared papers)O. van der Straten (3 shared papers)Adrian R. Muxworthy (1 shared paper)K. Cheng (1 shared paper)Huai Huang (1 shared paper)T. Standaert (1 shared paper)C.-C. Yang (1 shared paper)
- Journals
- Tribology Transactions (2 papers)Physical review. B. (1 paper)Journal of The Electrochemical Society (1 paper)IEEE Electron Device Letters (1 paper)ECS Transactions (1 paper)
- Partner nations
- United StatesVietnamGermany
In The Last Decade
C. Penny
9 papers receiving 99 citations
Peers
Comparison fields: 5 of 22
- Electronic, Optical and Magnetic Materials 56
- Electrical and Electronic Engineering 76
- Mechanics of Materials 16
- Condensed Matter Physics 7
- Atomic and Molecular Physics, and Optics 17
Countries citing papers authored by C. Penny
This map shows the geographic impact of C. Penny's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Penny with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Penny more than expected).
Fields of papers citing papers by C. Penny
This network shows the impact of papers produced by C. Penny. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Penny. The network helps show where C. Penny may publish in the future.
Co-authors
The 25 scholars most cited alongside C. Penny, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2019 | 39 | |
| 2 | 2020 | 17 | |
| 3 | 2019 | 13 | |
| 4 | 2017 | 12 | |
| 5 | 2014 | 11 | |
| 6 | 2013 | 6 | |
| 7 | 2023 | 3 | |
| 8 | 2012 | 3 | |
| 9 | 2023 | 2 |
About C. Penny
C. Penny is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Mechanical Engineering and Molecular Biology, having authored 9 papers that have together received 106 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (6 papers), Semiconductor materials and devices (5 papers), Metal and Thin Film Mechanics (2 papers), Tribology and Lubrication Engineering (2 papers), Gear and Bearing Dynamics Analysis (2 papers), Theoretical and Computational Physics (1 paper), Mechanical Engineering and Vibrations Research (1 paper) and Semiconductor materials and interfaces (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (56 citations), Electrical and Electronic Engineering (76 citations), Mechanics of Materials (16 citations), Condensed Matter Physics (7 citations) and Atomic and Molecular Physics, and Optics (17 citations). C. Penny has collaborated with scholars based in United States, Vietnam and Germany. Frequent co-authors include Nicholas A. Lanzillo, K. Motoyama, O. van der Straten, Adrian R. Muxworthy, K. Cheng, Huai Huang, T. Standaert, C.-C. Yang, Karl Fabian and Griselda Bonilla. Their work appears in journals such as Tribology Transactions, Physical review. B., Journal of The Electrochemical Society, IEEE Electron Device Letters and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.