T. Sullivan

490 citations

18 papers · 343 · h-index 9

Impact in

Electronic, Optical and Magnetic Materials top 10%
- Copper Interconnects and Reliability
Geochemistry and Petrology top 10%
- Groundwater and Isotope Geochemistry

Papers in

Electrical and Electronic Engineering 12
- Semiconductor materials and devices 8
- Electronic Packaging and Soldering Technologies 7
- 3D IC and TSV technologies 4
Electronic, Optical and Magnetic Materials 8
- Copper Interconnects and Reliability 8

Co-authors: J. Gill (8 shared papers)Yongli Gao (4 shared papers)F. Chen (4 shared papers)J. R. Lloyd (1 shared paper)Kaushik Chanda (1 shared paper)D. Harmon (5 shared papers)J. Aitken (2 shared papers)P. McLaughlin (1 shared paper)
Journals: Journal of Hydrology (2 papers)Ancient Mesoamerica (1 paper)Environmental Earth Sciences (1 paper)Microelectronics Reliability (1 paper)ECS Transactions (1 paper)
Partner nations: United States Germany United Kingdom

In The Last Decade

T. Sullivan

16 papers receiving 315 citations

Peers

Countries citing papers authored by T. Sullivan

Since Specialization

Citations

This map shows the geographic impact of T. Sullivan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Sullivan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Sullivan more than expected).

Fields of papers citing papers by T. Sullivan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Sullivan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Sullivan. The network helps show where T. Sullivan may publish in the future.

Co-authors

The 25 scholars most cited alongside T. Sullivan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with T. Sullivan Line = papers co-authored together T. Sullivan links everyone, so they are left out of the graph.

All Works

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18 of 18 papers shown

#	Work
1	A Comprehensive Study of Low-k SiCOH TDDB Phenomena and Its Reliability Lifetime Model Development F. Chen, (unknown), Kaushik Chanda, P. McLaughlin, T. Sullivan, J. Gill, J. R. Lloyd, R. Kontra, J. Aitken	2006	131
2	Nitrate transport in a karst aquifer: Numerical model development and source evaluation Journal of Hydrology ·T. Sullivan, Yongli Gao, Thomas Reimann	2019	33
3	Investigation of via-dominated multi-modal electromigration failure distributions in dual damascene Cu interconnects with a discussion of the statistical implications J. Gill, T. Sullivan, S. Yankee, H. J. Barth, A. von Glasow	2003	32
4	Characterization and reliability of TaN thin film resistors T. Lee, K. Watson, Chen Fen, J. Gill, D. Harmon, T. Sullivan, Baozhen Li	2004	22
5	Thermal conductance of IC interconnects embedded in dielectrics D. Harmon, J. Gill, T. Sullivan	2002	21
6	Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics F. Chen, J. Gill, D. Harmon, T. Sullivan, B. Li, A. Strong, H. Rathore, D. C. Edelstein, C.-C. Yang, A. Cowley, L. A. Clevenger	2004	19
7	Development of a new P3 (Probability, Protection, and Precipitation) method for vulnerability, hazard, and risk intensity index assessments in karst watersheds Journal of Hydrology ·T. Sullivan, Yongli Gao	2017	16
8	The Size of the Aztec City of Yautepec Ancient Mesoamerica ·Michael E. Smith, Cynthia Heath-Smith, Ronald Kohler, Joan Odess, Sharon Spanogle, T. Sullivan	1994	15
9	Assessment of nitrogen inputs and yields in the Cibolo and Dry Comal Creek watersheds using the SWAT model, Texas, USA 1996–2010 Environmental Earth Sciences ·T. Sullivan, Yongli Gao	2016	11
10	Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures Microelectronics Reliability ·F. Chen, J. Gill, D. Harmon, T. Sullivan, A. Strong, B. Li, H. Rathore, D. C. Edelstein	2005	8
11	Predicting thermal behavior of interconnects J. Gill, D. Harmon, Jun Furukawa, T. Sullivan	2003	8
12	Solder Bump Electromigration and CPI Challenges in Low-k Devices ECS Transactions ·Robin Susko, T. Daubenspeck, Thomas Wassick, T. Sullivan, Wolfgang Sauter, John Cincotta	2009	7
13	U.S. Geological Survey Karst Interest Group Proceedings, San Antonio, Texas, May 16–18, 2017 Scientific investigations report ·Barry F. Beck, Philip E. LaMoreaux, Amy Clark, Yongli Gao, Keith Muehlestein, Marcus Gary, George Veni, Dale L. Pate, T. Sullivan, Lithology Kau, A. J. Chalk, Kbu Buda, Limestone Kdr, Del Río, Clay Kef, (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), 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14	Technology Reliability Qualification of a 65nm CMOS Cu/Low-k BEOL Interconnect F. Chen, B. Li, Tae‐Gon Lee, C. Christiansen, J. Gill, M. Angyal, M. Shinosky, Chad Burke, W. Hasting, R. Austin, T. Sullivan, D. Badami, J. Aitken	2006	6
15	Novel design and integration enhancements in the final polymeric passivation for improved mechanical performance and C4 electromigration in lead-free C4 products E. Misra, T. Daubenspeck, Thomas Wassick, George Scott, Krishna Tunga, G. Lafontant, D. Questad, George E. Osborne, T. Sullivan	2012	4
16	Evaluating the Potential Impact of Smart Grid Funding on Reducing the Economic Impact of Large Outage Events in the United States from 2003 to 2017 Shawn A. Adderly, Todd E. Peterson, Daria Manukian, T. Sullivan, Mun S. Son, Ruth M. Mickey	2019	3
17	Discussion Group Summary Interconnect Reliability - with A Focus On Copper T. Sullivan, D.G. Pierce	1998	1
18	Characterization of extrusion formation during high temperature anneal J. Kelsey-Wynne, F. Chen, Jun Furukawa, T. Sullivan	2002	0

About T. Sullivan

T. Sullivan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Environmental Engineering, Earth-Surface Processes and Geochemistry and Petrology, having authored 18 papers that have together received 343 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (8 papers), Semiconductor materials and devices (8 papers), Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers), Karst Systems and Hydrogeology (3 papers), Groundwater and Isotope Geochemistry (2 papers), Urban Stormwater Management Solutions (1 paper) and Capital Investment and Risk Analysis (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (188 citations), Geochemistry and Petrology (42 citations), Earth-Surface Processes (34 citations), Electrical and Electronic Engineering (251 citations) and Environmental Engineering (49 citations). T. Sullivan has collaborated with scholars based in United States, Germany and United Kingdom. Frequent co-authors include J. Gill, Yongli Gao, F. Chen, J. R. Lloyd, Kaushik Chanda, D. Harmon, J. Aitken, P. McLaughlin, Thomas Reimann and H. Rathore. Their work appears in journals such as Journal of Hydrology, Ancient Mesoamerica, Environmental Earth Sciences, Microelectronics Reliability and ECS Transactions.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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T. Sullivan

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