J. M. E. Harper
Impact in
-
- Copper Interconnects and Reliability
- Mechanics of Materials top 0.5%
- Metal and Thin Film Mechanics
Papers in
-
- Semiconductor materials and devices 58
- Electronic Packaging and Soldering Technologies 11
-
- Copper Interconnects and Reliability 58
- Co-authors
- C. Cabral (58 shared papers)F. M. d’Heurle (22 shared papers)J. J. Cuomo (8 shared papers)H. R. Kaufman (10 shared papers)C.‐K. Hu (4 shared papers)J. J. Cuomo (19 shared papers)P. M. Fryer (11 shared papers)K. P. Rodbell (4 shared papers)
- Journals
- Journal of Applied Physics (28 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (18 papers)Applied Physics Letters (13 papers)Thin Solid Films (11 papers)Journal of materials research/Pratt's guide to venture capital sources (6 papers)
- Partner nations
- United StatesSwedenCanada
In The Last Decade
J. M. E. Harper
156 papers receiving 5.6k citations
J. M. E. Harper's Hit Papers
Peers
Comparison fields: 5 of 81
- Electronic, Optical and Magnetic Materials 2.4k
- Mechanics of Materials 2.0k
- Electrical and Electronic Engineering 3.8k
- Atomic and Molecular Physics, and Optics 1.7k
- Condensed Matter Physics 497
Countries citing papers authored by J. M. E. Harper
This map shows the geographic impact of J. M. E. Harper's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. M. E. Harper with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. M. E. Harper more than expected).
Fields of papers citing papers by J. M. E. Harper
This network shows the impact of papers produced by J. M. E. Harper. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. M. E. Harper. The network helps show where J. M. E. Harper may publish in the future.
Co-authors
The 25 scholars most cited alongside J. M. E. Harper, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 158 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions Hit paper breakdown → | 1992 | 401 |
| 2 | 1999 | 324 | |
| 3 | 1989 | 266 | |
| 4 | 1998 | 234 | |
| 5 | 1982 | 202 | |
| 6 | 1993 | 188 | |
| 7 | 1982 | 184 | |
| 8 | 1992 | 157 | |
| 9 | 1997 | 146 | |
| 10 | 1982 | 139 | |
| 11 | 1977 | 123 | |
| 12 | 1978 | 122 | |
| 13 | 2006 | 119 | |
| 14 | Thin film processing and characterization of high-temperature superconductors | 1988 | 118 |
| 15 | 1983 | 107 | |
| 16 | 2006 | 104 | |
| 17 | 1995 | 103 | |
| 18 | 1993 | 100 | |
| 19 | 1986 | 99 | |
| 20 | 1978 | 97 |
About J. M. E. Harper
J. M. E. Harper is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanics of Materials and Materials Chemistry, having authored 158 papers that have together received 6.0k indexed citations. Recurring topics across this work include Semiconductor materials and devices (58 papers), Copper Interconnects and Reliability (58 papers), Semiconductor materials and interfaces (49 papers), Metal and Thin Film Mechanics (45 papers), Ion-surface interactions and analysis (33 papers), Intermetallics and Advanced Alloy Properties (13 papers), Aluminum Alloys Composites Properties (11 papers) and Electronic Packaging and Soldering Technologies (11 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (2.4k citations), Mechanics of Materials (2.0k citations), Electrical and Electronic Engineering (3.8k citations), Atomic and Molecular Physics, and Optics (1.7k citations) and Condensed Matter Physics (497 citations). J. M. E. Harper has collaborated with scholars based in United States, Sweden and Canada. Frequent co-authors include C. Cabral, F. M. d’Heurle, J. J. Cuomo, H. R. Kaufman, C.‐K. Hu, J. J. Cuomo, P. M. Fryer, K. P. Rodbell, H. T. G. Hentzell and Katayun Barmak. Their work appears in journals such as Journal of Applied Physics, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, Applied Physics Letters, Thin Solid Films and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.