J. Van Olmen

1.3k citations

31 papers · 504 · h-index 11

Impact in

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Photolithography Techniques
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability

Papers in

Electrical and Electronic Engineering 28
- 3D IC and TSV technologies 12
- Electronic Packaging and Soldering Technologies 12
- Semiconductor materials and devices 7
- Advancements in Photolithography Techniques 4
- CCD and CMOS Imaging Sensors 4
Electronic, Optical and Magnetic Materials 11
- Copper Interconnects and Reliability 11

Co-authors: Wim Dehaene (5 shared papers)Guruprasad Katti (5 shared papers)Michele Stucchi (7 shared papers)K. De Meyer (4 shared papers)Cedric Huyghebaert (7 shared papers)Eric Beyne (7 shared papers)Youssef Travaly (9 shared papers)Anne Jourdain (6 shared papers)
Journals: Microelectronics Reliability (7 papers)Microelectronic Engineering (2 papers)IEEE Electron Device Letters (1 paper)IEEE Transactions on Semiconductor Manufacturing (1 paper)Sensors (1 paper)
Partner nations: Belgium Netherlands United States

In The Last Decade

J. Van Olmen

29 papers receiving 487 citations

Peers

Countries citing papers authored by J. Van Olmen

Since Specialization

Citations

This map shows the geographic impact of J. Van Olmen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Van Olmen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Van Olmen more than expected).

Fields of papers citing papers by J. Van Olmen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Van Olmen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Van Olmen. The network helps show where J. Van Olmen may publish in the future.

Co-authors

The 25 scholars most cited alongside J. Van Olmen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J. Van Olmen Line = papers co-authored together J. Van Olmen links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

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#	Work
1	Through-Silicon-Via Capacitance Reduction Technique to Benefit 3-D IC Performance IEEE Electron Device Letters ·Guruprasad Katti, Michele Stucchi, J. Van Olmen, K. De Meyer, Wim Dehaene	2010	74
2	Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration Microelectronic Engineering ·J. Van Olmen, Cedric Huyghebaert, Jan Coenen, J. Van Aelst, Erik Sleeckx, A. Van Ammel, Silvia Armini, Guruprasad Katti, Jan Vaes, Wim Dehaene, Eric Beyne, Youssef Travaly	2010	59
3	3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding Guruprasad Katti, Ali Merç, J. Van Olmen, Cedric Huyghebaert, Anne Jourdain, Michele Stucchi, Michał Rakowski, I. Debusschere, P. Soussan, Wim Dehaene, K. De Meyer, Youssef Travaly, Eric Beyne, S. Biesemans, Bart Swinnen	2009	56
4	Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors Sensors ·Paweł E. Malinowski, Epimitheas Georgitzikis, Jorick Maes, Ioanna Vamvaka, Fortunato Frazzica, J. Van Olmen, Piet De Moor, Paul Heremans, Zeger Hens, David Cheyns	2017	45
5	Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration AIP conference proceedings ·Chukwudi Okoro, Cedric Huyghebaert, J. Van Olmen, Riet Labie, Konstantza Lambrinou, Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Ehrenfried Zschech, Shinichi Ogawa, Paul S. Ho	2010	40
6	Double patterning scheme for sub-0.25 k1 single damascene structures at NA=0.75, λ=193nm Mireille Maenhoudt, Janko Versluijs, Herbert Struyf, J. Van Olmen, M. Van Hove	2005	39
7	3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV) J. Van Olmen, Jan Coenen, Wim Dehaene, K. De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, A. Mercha, Michał Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen	2009	36
8	Temperature dependent electrical characteristics of through-si-via (TSV) interconnections Guruprasad Katti, A. Mercha, Michele Stucchi, Zs. Tôkei, Dimitrios Velenis, J. Van Olmen, Cedric Huyghebaert, Anne Jourdain, Michał Rakowski, I. Debusschere, P. Soussan, Herman Oprins, Wim Dehaene, K. De Meyer, Youssef Travaly, Eric Beyne, S. Biesemans, Bart Swinnen	2010	26
9	Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures Microelectronics Reliability ·Yusen Yang, Riet Labie, (unknown), Cheng Zhao, Aleksandar Radisic, J. Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf	2010	17
10	Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding Cedric Huyghebaert, J. Van Olmen, Yann Civale, Alain Phommahaxay, Anne Jourdain, Sumant Sood, Shari Farrens, Philippe Soussan	2010	15
11	Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications using RELACS shrink and corresponding OPC Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Maaike Op de Beeck, Janko Versluijs, Vincent Wiaux, T. Vandeweyer, Ivan Ciofi, Herbert Struyf, D. Hendrickx, J. Van Olmen	2007	11
12	On a More Accurate Assessment of Scaled Copper/Low-k Interconnects Performance IEEE Transactions on Semiconductor Manufacturing ·Youssef Travaly, Bamal Mandeep, L. Carbonell, Zs. Tôkei, J. Van Olmen, Francesca Iacopi, M. Van Hove, Michele Stucchi, Karen Maex	2007	10
13	On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes ECS Transactions ·Celso Cavaco, Lan Peng, Farid Sebaai, Greet Verbinnen, Jakob Visker, J. Van Olmen, Deniz Sabuncuoglu Tezcan, Haris Osman	2015	9
14	Enabling 10µm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias Cedric Huyghebaert, J. Van Olmen, Okoro Chukwudi, Jens Coenen, Anne Jourdain, Marc van Cauwenberghe, Rahul Agarwahl, Alain Phommahaxay, Michele Stucchi, Philippe Soussan	2010	9
15	TSV metrology and inspection challenges Ramakanth Alapati, Youssef Travaly, J. Van Olmen, Ricardo Cotrin Teixeira, Jan Vaes, Marc van Cauwenbergh, A. Jourdain, Greet Verbinnen, Gino Marcuccilli, Glenn Florence, Shay Wolfling, Christine Pelissier, Haiping Zhang, Jaydeep K. Sinha, Andreas Machura, Irfan Malik	2009	8
16	Through-Si-Via Technology Solutions for 3D System Integration Eric Beyne, Bart Swinnen, J. Van Olmen, Deniz Sabuncuoglu Tezcan, Anne Jourdain, P K Limaye	2009	8
17	The influence of addition elements on the early resistance changes observed during electromigration testing of Al metal lines Microelectronics Reliability ·W.A De Ceuninck, V. D’Haeger, J. Van Olmen, Ann Witvrouw, Karen Maex, L. De Schepper, Peter De Pauw, A Pergoot	1998	7
18	Photonics-CMOS 3D integration: copper through-silicon-via approach Ghent University Academic Bibliography (Ghent University) ·Adil Masood, Wim Bogaerts, J. Van Olmen, J. Van Aelst, Dries Van Thourhout, Deniz Sabuncuoglu Tezcan	2009	6
19	Novel technology for microlenses for imaging applications Applied Optics ·Vasyl Motsnyi, Ingrid De Wolf, Véronique Rochus, Xavier Rottenberg, Özlem Cangar, J. Van Olmen, Stefano Guerrieri, Piet De Moor, Mustapha Zahir	2018	5
20	Low-damage damascene patterning of SiOC(H) low-k dielectrics Herbert Struyf, D. Hendrickx, J. Van Olmen, Francesca Iacopi, Olivier Richard, Youssef Travaly, M. Van Hove, Werner Boullart, S. Vanhaelemeersch	2005	4

About J. Van Olmen

J. Van Olmen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Automotive Engineering and Biomedical Engineering, having authored 31 papers that have together received 504 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (12 papers), Copper Interconnects and Reliability (11 papers), Semiconductor materials and devices (7 papers), Additive Manufacturing and 3D Printing Technologies (6 papers), Semiconductor materials and interfaces (5 papers), Advancements in Photolithography Techniques (4 papers) and CCD and CMOS Imaging Sensors (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (480 citations), Electronic, Optical and Magnetic Materials (88 citations), Automotive Engineering (38 citations), Biomedical Engineering (115 citations) and Surfaces, Coatings and Films (18 citations). J. Van Olmen has collaborated with scholars based in Belgium, Netherlands and United States. Frequent co-authors include Wim Dehaene, Guruprasad Katti, Michele Stucchi, K. De Meyer, Cedric Huyghebaert, Eric Beyne, Youssef Travaly, Anne Jourdain, Herbert Struyf and M. Van Hove. Their work appears in journals such as Microelectronics Reliability, Microelectronic Engineering, IEEE Electron Device Letters, IEEE Transactions on Semiconductor Manufacturing and Sensors.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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