Guruprasad Katti
About
Guruprasad Katti has authored 18 papers that have received a total of 617 indexed citations.
This includes 18 papers in Electrical and Electronic Engineering, 3 papers in Atomic and Molecular Physics, and Optics and 3 papers in Hardware and Architecture. The topics of these papers are 3D IC and TSV technologies (17 papers), Semiconductor materials and devices (8 papers) and Electronic Packaging and Soldering Technologies (5 papers). Guruprasad Katti is often cited by papers focused on 3D IC and TSV technologies (17 papers), Semiconductor materials and devices (8 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in Singapore, Belgium and United States. Guruprasad Katti's co-authors include Michele Stucchi, Wim Dehaene, K. De Meyer, Dimitrios Velenis and Roshan Weerasekera and has published in prestigious journals such as Proceedings of the IEEE, IEEE Transactions on Electron Devices and IEEE Electron Device Letters.
In The Last Decade
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