J. Hicks

3.1k citations
40 papers · 722 · h-index 14

Impact in

  • Hardware and Architecture top 5%
    • VLSI and Analog Circuit Testing
  • Electrical and Electronic Engineering top 5%
    • Semiconductor materials and devices
    • Advancements in Semiconductor Devices and Circuit Design
    • Integrated Circuits and Semiconductor Failure Analysis
    • Radiation Effects in Electronics
    • Ferroelectric and Negative Capacitance Devices
    • Advanced Memory and Neural Computing

Papers in

  • Electrical and Electronic Engineering 31
    • Semiconductor materials and devices 22
    • Integrated Circuits and Semiconductor Failure Analysis 17
    • Advancements in Semiconductor Devices and Circuit Design 16
    • Ferroelectric and Negative Capacitance Devices 6
    • Advanced Memory and Neural Computing 4
    • Electrostatic Discharge in Electronics 4
  • Geometry and Topology 8
    • Algebraic Geometry and Number Theory 5
Co-authors
S. Ramey (10 shared papers)C. Auth (4 shared papers)Robert B. Miller (3 shared papers)Anisur Rahman (3 shared papers)M. Hattendorf (2 shared papers)Jason Clifford (1 shared paper)C. Wiegand (1 shared paper)A. St. Amour (1 shared paper)
Journals
IEEE Transactions on Device and Materials Reliability (1 paper)Journal of Topology (1 paper)IEEE Transactions on Nuclear Science (1 paper)Algebraic & Geometric Topology (1 paper)Commentarii Mathematici Helvetici (1 paper)
Partner nations
United StatesUnited KingdomGreece

In The Last Decade

J. Hicks

38 papers receiving 695 citations

Peers

J. Hicks
Comparison fields: 5 of 43
  • Hardware and Architecture 99
  • Electrical and Electronic Engineering 674
  • Electronic, Optical and Magnetic Materials 62
  • Geometry and Topology 21
  • Safety, Risk, Reliability and Quality 14
Replace Phil Oldiges with:
Phil Oldiges United States
Yuanfu Zhao China
G. Cellere Italy
D. Becher United States
V. Reddy United States
J.-H. Chern United States
Didier Lattard France
Chao Han China
B. Parker United States
Sheng‐Chih Lin United States
J. Hicks relative to Phil Oldiges United States Phil Oldiges's profile →
Citations per field
00.5×1.7×
Phil Oldiges · 1×
Citations per year

Countries citing papers authored by J. Hicks

Since Specialization
Citations

This map shows the geographic impact of J. Hicks's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Hicks with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Hicks more than expected).

Fields of papers citing papers by J. Hicks

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Hicks. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Hicks. The network helps show where J. Hicks may publish in the future.

Co-authors

The 25 scholars most cited alongside J. Hicks, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J. Hicks Line = papers co-authored together J. Hicks links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown

Showing the 20 most-cited of 40 papers — load more, or switch the sort, to bring in the rest.

#Work
1
Intrinsic transistor reliability improvements from 22nm tri-gate technology
S. Ramey, A. Ashutosh, C. Auth, Jason Clifford, M. Hattendorf, J. Hicks, R. James, Anisur Rahman, Varun Sharma, A. St. Amour, C. Wiegand
2013145
2
Soft Error Rate Improvements in 14-nm Technology Featuring Second-Generation 3D Tri-Gate Transistors
IEEE Transactions on Nuclear Science ·N. Seifert, Shah M. Jahinuzzaman, Jyothi Velamala, Ricardo Ascázubi, Nikunj Patel, B. Gill, Joseph M. Basile, J. Hicks
201591
3
A PROM element based on salicide agglomeration of poly fuses in a CMOS logic process
M. Alavi, M. Bohr, J. Hicks, M. Denham, A. Cassens, D. Douglas, Ming-Yan Tsai
200255
4
Microprocessor reliability performance as a function of die location for a 0.25 μ, five layer metal CMOS logic process
W.C. Riordan, Robert B. Miller, Jamie Sherman, J. Hicks
200350
5
Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology
Flavio Griggio, J. Palmer, Fuxiang Pan, Nikholas G. Toledo, A. Schmitz, Ilan Tsameret, Rahim Kasim, G. Leatherman, J. Hicks, Advait Madhavan, Jin-Ho Shin, Joseph M. Steigerwald, A. Yeoh, C. Auth
201848
6
Frequency and recovery effects in high-κ BTI degradation
S. Ramey, (unknown), (unknown), Sangwoo Pae, S.V. Walstra, Satrajit Gupta, J. Hicks
200941
7
Bias temperature instability variation on SiON/Poly, HK/MG and trigate architectures
C. Prasad, M. Agostinelli, J. Hicks, S. Ramey, C. Auth, K. Mistry, S. Natarajan, P. Packan, I. Post, Srinivas Bodapati, M.D. Giles, Sarthak Gupta, S. Mudanai, Kelin J. Kuhn
201436
8
Transistor reliability variation correlation to threshold voltage
S. Ramey, Manisha Chahal, P. Nayak, S. Novak, C. Prasad, J. Hicks
201524
9
BTI recovery in 22nm tri-gate technology
S. Ramey, J. Hicks, Luckshitha Suriyasena Liyanage, S. Novak
201419
10
eNVM RRAM reliability performance and modeling in 22FFL FinFET technology
Yao‐Feng Chang, James A. O'Donnell, (unknown), R. Kotlyar, Albert Chen, Pedro A. Quintero, Nathan Strutt, O. Golonzka, Chris Connor, J. Hicks
202018
11
Die-package stress interaction impact on transistor performance
G. Leatherman, Jessica Xu, J. Hicks, Bahattin Kilic, Daniel Pantuso
201217
12
Gate dielectric TDDB characterizations of advanced High-k and metal-gate CMOS logic transistor technology
Sangwoo Pae, C. Prasad, S. Ramey, J. Thomas, Anisur Rahman, Ryan Lu, J. Hicks, S. Batzer, Qingda Zhao, Jonathan Hatfield, M. Liu, C. Parker, B. Woolery
201216
13
Reliability studies of a 22nm SoC platform technology featuring 3-D tri-gate, optimized for ultra low power, high performance and high density application
Anisur Rahman, (unknown), G. Curello, J. Hicks, C.-H Jan, Mubasher Jamil, Jang Hyeok Park, K. Phoa, Mustafijur Rahman, C. Tsai, B. Woolery, J.-Y. Yeh
201315
14
Aging model challenges in deeply scaled tri-gate technologies
S. Ramey, Y.H. Lu, Inanc Meric, S. Mudanai, S. Novak, C. Prasad, J. Hicks
201515
15
Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel’s 10+ Process
Che-Yun Lin, Uygar E. Avci, M. A. Blount, R. Grover, J. Hicks, Rahim Kasim, Arun Chandra Kundu, C. Pelto, C. Ryder, A. Schmitz, Kanika Sethi, Dragos Seghete, D. J. Towner, Albert Welsh, J. R. Weber, C. Auth
202013
16
Modeling Framework for Transistor Aging Playback in Advanced Technology Nodes
Inanc Meric, S. Ramey, S. Novak, Sarthak Gupta, S. Mudanai, J. Hicks
202013
17
Characterization of SILC and its end-of-life reliability assessment on 45NM high-K and metal-gate technology
Sangwoo Pae, T. Ghani, M. Hattendorf, J. Hicks, J. Jopling, J. Maiz, K. Mistry, James A. O'Donnell, C. Prasad, Jami Wiedemer, Jian Xu
200912
18
Tropical Lagrangian hypersurfaces are unobstructed
Journal of Topology ·J. Hicks
20209
19
Accelerated stress testing methodology to risk assess silicon-package thermomechanical failure modes resulting from moisture exposure under use condition
Scholarworks@UNIST (Ulsan National Institute of Science and Technology) ·S. Rangaraj, Daeil Kwon, Min Pei, J. Hicks, G. Leatherman, Alan Lucero, T.A. Wilson, S. Streit, Jun He
20139
20
Characterization and challenge of TDDB reliability in Cu/low K dielectric interconnect
Xia Feng, Jun He, Prad Prabhumirashi, A. Schmitz, Anthony Lowrie, J. Hicks, Y. Shusterman, Ruth Brain
20118

About J. Hicks

J. Hicks is a scholar working on Electrical and Electronic Engineering, Geometry and Topology, Electronic, Optical and Magnetic Materials, Mathematical Physics and Computational Theory and Mathematics, having authored 40 papers that have together received 722 indexed citations. Recurring topics across this work include Semiconductor materials and devices (22 papers), Integrated Circuits and Semiconductor Failure Analysis (17 papers), Advancements in Semiconductor Devices and Circuit Design (16 papers), Ferroelectric and Negative Capacitance Devices (6 papers), Algebraic Geometry and Number Theory (5 papers), Copper Interconnects and Reliability (5 papers), Advanced Memory and Neural Computing (4 papers) and Electrostatic Discharge in Electronics (4 papers). The work is most often cited by research in Hardware and Architecture (99 citations), Electrical and Electronic Engineering (674 citations), Electronic, Optical and Magnetic Materials (62 citations), Geometry and Topology (21 citations) and Safety, Risk, Reliability and Quality (14 citations). J. Hicks has collaborated with scholars based in United States, United Kingdom and Greece. Frequent co-authors include S. Ramey, C. Auth, Robert B. Miller, Anisur Rahman, M. Hattendorf, Jason Clifford, C. Wiegand, A. St. Amour, S. Novak and Jamie Sherman. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, Journal of Topology, IEEE Transactions on Nuclear Science, Algebraic & Geometric Topology and Commentarii Mathematici Helvetici.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Phil OldigesBreakdown of academic impact, for papers by Yuanfu ZhaoBreakdown of academic impact, for papers by G. CellereBreakdown of academic impact, for papers by D. BecherBreakdown of academic impact, for papers by V. ReddyBreakdown of academic impact, for papers by J.-H. ChernBreakdown of academic impact, for papers by Didier LattardBreakdown of academic impact, for papers by Chao HanBreakdown of academic impact, for papers by B. ParkerBreakdown of academic impact, for papers by Sheng‐Chih Lin