Daniel Pantuso
Impact in
- Hardware and Architecture top 2%
- Parallel Computing and Optimization Techniques
- Mechanics of Materials top 5%
- Metal and Thin Film Mechanics
- Numerical methods in engineering
Papers in
-
- Semiconductor materials and devices 7
- Integrated Circuits and Semiconductor Failure Analysis 6
- Advancements in Semiconductor Devices and Circuit Design 5
- Electronic Packaging and Soldering Technologies 5
- 3D IC and TSV technologies 4
-
- Metal and Thin Film Mechanics 10
- Co-authors
- Klaus‐Jürgen Bathe (3 shared papers)Sadasivan Shankar (4 shared papers)Eduardo N. Dvorkin (4 shared papers)E.A. Repetto (3 shared papers)Donald W. Nelson (1 shared paper)Clair Webb (1 shared paper)Murali Annavaram (1 shared paper)Gabriel H. Loh (1 shared paper)
- Journals
- Acta Materialia (4 papers)Journal of materials research/Pratt's guide to venture capital sources (2 papers)Thin Solid Films (2 papers)Computer Methods in Applied Mechanics and Engineering (2 papers)Computers & Structures (2 papers)
- Partner nations
- United StatesSpainUnited Kingdom
In The Last Decade
Daniel Pantuso
32 papers receiving 1.0k citations
Daniel Pantuso's Hit Papers
Peers
Comparison fields: 5 of 58
- Hardware and Architecture 246
- Mechanics of Materials 393
- Computer Networks and Communications 264
- Electrical and Electronic Engineering 506
- Ceramics and Composites 40
Countries citing papers authored by Daniel Pantuso
This map shows the geographic impact of Daniel Pantuso's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel Pantuso with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel Pantuso more than expected).
Fields of papers citing papers by Daniel Pantuso
This network shows the impact of papers produced by Daniel Pantuso. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel Pantuso. The network helps show where Daniel Pantuso may publish in the future.
Co-authors
The 25 scholars most cited alongside Daniel Pantuso, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Die Stacking (3D) Microarchitecture Hit paper breakdown → | 2006 | 449 |
| 2 | 1999 | 105 | |
| 3 | 1995 | 74 | |
| 4 | 2000 | 70 | |
| 5 | 1997 | 54 | |
| 6 | 2015 | 53 | |
| 7 | 2003 | 39 | |
| 8 | 2006 | 33 | |
| 9 | 1995 | 33 | |
| 10 | 2003 | 20 | |
| 11 | 1994 | 17 | |
| 12 | 2012 | 16 | |
| 13 | 2021 | 16 | |
| 14 | 2017 | 15 | |
| 15 | 2003 | 15 | |
| 16 | 2006 | 11 | |
| 17 | 2019 | 8 | |
| 18 | 2020 | 8 | |
| 19 | 2019 | 7 | |
| 20 | 2019 | 6 |
About Daniel Pantuso
Daniel Pantuso is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Biomedical Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry, having authored 34 papers that have together received 1.1k indexed citations. Recurring topics across this work include Metal and Thin Film Mechanics (10 papers), Advanced Surface Polishing Techniques (9 papers), Copper Interconnects and Reliability (7 papers), Semiconductor materials and devices (7 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers), Electronic Packaging and Soldering Technologies (5 papers) and 3D IC and TSV technologies (4 papers). The work is most often cited by research in Hardware and Architecture (246 citations), Mechanics of Materials (393 citations), Computer Networks and Communications (264 citations), Electrical and Electronic Engineering (506 citations) and Ceramics and Composites (40 citations). Daniel Pantuso has collaborated with scholars based in United States, Spain and United Kingdom. Frequent co-authors include Klaus‐Jürgen Bathe, Sadasivan Shankar, Eduardo N. Dvorkin, E.A. Repetto, Donald W. Nelson, Clair Webb, Murali Annavaram, Gabriel H. Loh, P. Morrow and John Paul Shen. Their work appears in journals such as Acta Materialia, Journal of materials research/Pratt's guide to venture capital sources, Thin Solid Films, Computer Methods in Applied Mechanics and Engineering and Computers & Structures.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.