Meng-Kai Shih

30 papers and 160 indexed citations i.

Meng-Kai Shih is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Meng-Kai Shih has authored 30 papers receiving a total of 160 indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 7 papers in Mechanical Engineering. Recurrent topics in Meng-Kai Shih’s work include Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (18 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). Meng-Kai Shih is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (18 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). Meng-Kai Shih collaborates with scholars based in Taiwan. Meng-Kai Shih's co-authors include C.-P Hung, David Tarng, Karen Chen, Yi‐Shao Lai, W.H. Huang, Dao-Long Chen, De‐Shin Liu, Chen-Chao Wang, Μ. Y. Tsai and Tong Hong Wang and has published in prestigious journals such as IEEE Transactions on Electron Devices, Materials and Journal of Electronic Materials.