Arvind Sridhar
Impact in
- Hardware and Architecture top 5%
- Parallel Computing and Optimization Techniques
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- 3D IC and TSV technologies
- Low-power high-performance VLSI design
- Silicon Carbide Semiconductor Technologies
- VLSI and FPGA Design Techniques
- Semiconductor materials and devices
Papers in
-
- 3D IC and TSV technologies 13
- Silicon Carbide Semiconductor Technologies 12
- Advancements in Semiconductor Devices and Circuit Design 6
- Low-power high-performance VLSI design 4
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- Heat Transfer and Optimization 22
- Heat Transfer and Boiling Studies 8
- Co-authors
- David Atienza (22 shared papers)Thomas Brunschwiler (19 shared papers)Alessandro Vincenzi (9 shared papers)Martino Ruggiero (8 shared papers)Mohamed M. Sabry (8 shared papers)José L. Ayala (1 shared paper)David Cuesta (1 shared paper)Bruno Michel (7 shared papers)
- Journals
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (3 papers)IEEE Transactions on Computers (2 papers)IEEE Transactions on Electromagnetic Compatibility (1 paper)Journal of Electronic Packaging (1 paper)Integration (1 paper)
- Partner nations
- SwitzerlandUnited StatesSpain
In The Last Decade
Arvind Sridhar
36 papers receiving 829 citations
Peers
Comparison fields: 5 of 33
- Hardware and Architecture 219
- Electrical and Electronic Engineering 681
- Mechanical Engineering 289
- Computer Networks and Communications 134
- Automotive Engineering 53
Countries citing papers authored by Arvind Sridhar
This map shows the geographic impact of Arvind Sridhar's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Arvind Sridhar with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Arvind Sridhar more than expected).
Fields of papers citing papers by Arvind Sridhar
This network shows the impact of papers produced by Arvind Sridhar. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Arvind Sridhar. The network helps show where Arvind Sridhar may publish in the future.
Co-authors
The 25 scholars most cited alongside Arvind Sridhar, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 224 | |
| 2 | 2010 | 190 | |
| 3 | 2013 | 97 | |
| 4 | Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries | 2010 | 41 |
| 5 | 2010 | 30 | |
| 6 | 2011 | 26 | |
| 7 | 2013 | 25 | |
| 8 | 2016 | 19 | |
| 9 | 2015 | 16 | |
| 10 | 2017 | 14 | |
| 11 | 2013 | 14 | |
| 12 | 2017 | 14 | |
| 13 | 2011 | 13 | |
| 14 | 2012 | 12 | |
| 15 | 2011 | 11 | |
| 16 | 2017 | 10 | |
| 17 | 2009 | 9 | |
| 18 | 2015 | 9 | |
| 19 | 2014 | 8 | |
| 20 | 2014 | 7 |
About Arvind Sridhar
Arvind Sridhar is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Computational Mechanics, Electronic, Optical and Magnetic Materials and Automotive Engineering, having authored 36 papers that have together received 850 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (22 papers), 3D IC and TSV technologies (13 papers), Silicon Carbide Semiconductor Technologies (12 papers), Heat Transfer and Boiling Studies (8 papers), Advancements in Semiconductor Devices and Circuit Design (6 papers), Fluid Dynamics and Thin Films (6 papers), Low-power high-performance VLSI design (4 papers) and Supercapacitor Materials and Fabrication (4 papers). The work is most often cited by research in Hardware and Architecture (219 citations), Electrical and Electronic Engineering (681 citations), Mechanical Engineering (289 citations), Computer Networks and Communications (134 citations) and Automotive Engineering (53 citations). Arvind Sridhar has collaborated with scholars based in Switzerland, United States and Spain. Frequent co-authors include David Atienza, Thomas Brunschwiler, Alessandro Vincenzi, Martino Ruggiero, Mohamed M. Sabry, José L. Ayala, David Cuesta, Bruno Michel, Chin Lee Ong and Mohamed M. Sabry. Their work appears in journals such as IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on Computers, IEEE Transactions on Electromagnetic Compatibility, Journal of Electronic Packaging and Integration.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.