Mark Schultz
Impact in
- Mechanical Engineering top 5%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
- Refrigeration and Air Conditioning Technologies
- Hardware and Architecture top 10%
- Parallel Computing and Optimization Techniques
Papers in
-
- Heat Transfer and Optimization 28
- Heat Transfer and Boiling Studies 17
-
- Parallel Computing and Optimization Techniques 6
- Co-authors
- Timothy Chainer (28 shared papers)Pritish R. Parida (27 shared papers)Michael A. Gaynes (18 shared papers)Mark H. KRYDER (7 shared papers)Milnes P. David (8 shared papers)Madhusudan Iyengar (6 shared papers)Roger R. Schmidt (6 shared papers)Robert E. Simons (6 shared papers)
- Journals
- Journal of Applied Physics (5 papers)IEEE Transactions on Magnetics (4 papers)Journal of Electronic Packaging (2 papers)Japanese Journal of Applied Physics (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)
- Partner nations
- United StatesSwitzerlandJapan
In The Last Decade
Mark Schultz
48 papers receiving 653 citations
Peers
Comparison fields: 5 of 65
- Mechanical Engineering 434
- Hardware and Architecture 76
- Computational Mechanics 99
- Electrical and Electronic Engineering 199
- Chemical Health and Safety 2
Countries citing papers authored by Mark Schultz
This map shows the geographic impact of Mark Schultz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mark Schultz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mark Schultz more than expected).
Fields of papers citing papers by Mark Schultz
This network shows the impact of papers produced by Mark Schultz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mark Schultz. The network helps show where Mark Schultz may publish in the future.
Co-authors
The 25 scholars most cited alongside Mark Schultz, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 55 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 86 | |
| 2 | 2017 | 70 | |
| 3 | 2021 | 70 | |
| 4 | 2012 | 45 | |
| 5 | 2012 | 30 | |
| 6 | 2016 | 30 | |
| 7 | 2015 | 27 | |
| 8 | 1981 | 25 | |
| 9 | 2015 | 21 | |
| 10 | 2012 | 20 | |
| 11 | 2017 | 20 | |
| 12 | 1990 | 19 | |
| 13 | 2016 | 18 | |
| 14 | 1991 | 15 | |
| 15 | 2012 | 14 | |
| 16 | 2017 | 14 | |
| 17 | 1995 | 14 | |
| 18 | 1989 | 12 | |
| 19 | 2017 | 11 | |
| 20 | 1991 | 10 |
About Mark Schultz
Mark Schultz is a scholar working on Mechanical Engineering, Hardware and Architecture, Electrical and Electronic Engineering, Computational Mechanics and Atomic and Molecular Physics, and Optics, having authored 55 papers that have together received 705 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (28 papers), Heat Transfer and Boiling Studies (17 papers), Magnetic properties of thin films (10 papers), Fluid Dynamics and Thin Films (8 papers), Magneto-Optical Properties and Applications (7 papers), Parallel Computing and Optimization Techniques (6 papers), 3D IC and TSV technologies (4 papers) and Advanced Data Storage Technologies (4 papers). The work is most often cited by research in Mechanical Engineering (434 citations), Hardware and Architecture (76 citations), Computational Mechanics (99 citations), Electrical and Electronic Engineering (199 citations) and Chemical Health and Safety (2 citations). Mark Schultz has collaborated with scholars based in United States, Switzerland and Japan. Frequent co-authors include Timothy Chainer, Pritish R. Parida, Michael A. Gaynes, Mark H. KRYDER, Milnes P. David, Madhusudan Iyengar, Roger R. Schmidt, Robert E. Simons, Vinod Kamath and Fanghao Yang. Their work appears in journals such as Journal of Applied Physics, IEEE Transactions on Magnetics, Journal of Electronic Packaging, Japanese Journal of Applied Physics and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.