Bob Willis
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
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- Engine and Fuel Emissions
Papers in
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- Electronic Packaging and Soldering Technologies 14
- 3D IC and TSV technologies 2
- Green IT and Sustainability 1
- Integrated Circuits and Semiconductor Failure Analysis 1
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- Management Systems and Quality Improvement 1
- Journals
- Soldering and Surface Mount Technology (7 papers)Microelectronics International (5 papers)Circuit World (3 papers)
- Partner nations
- United Kingdom
In The Last Decade
Bob Willis
14 papers receiving 292 citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 243
- Automotive Engineering 14
- Industrial and Manufacturing Engineering 12
- Statistics, Probability and Uncertainty 9
- Hardware and Architecture 8
Countries citing papers authored by Bob Willis
This map shows the geographic impact of Bob Willis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bob Willis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bob Willis more than expected).
Fields of papers citing papers by Bob Willis
This network shows the impact of papers produced by Bob Willis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bob Willis. The network helps show where Bob Willis may publish in the future.
Co-authors
The 2 scholars most cited alongside Bob Willis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 89 | |
| 2 | 2003 | 43 | |
| 3 | 2004 | 43 | |
| 4 | 2003 | 39 | |
| 5 | 2005 | 31 | |
| 6 | 2003 | 26 | |
| 7 | 2003 | 23 | |
| 8 | 2003 | 9 | |
| 9 | 2003 | 9 | |
| 10 | 2003 | 6 | |
| 11 | 2005 | 6 | |
| 12 | 2006 | 3 | |
| 13 | 2004 | 1 | |
| 14 | 2008 | 1 | |
| 15 | 1992 | 0 | |
| 16 | Measurements of copper dissolution in lead-free solder alloys. | 2008 | 0 |
| 17 | 2009 | 0 |
About Bob Willis
Bob Willis is a scholar working on Electrical and Electronic Engineering, Strategy and Management, Waste Management and Disposal, Management of Technology and Innovation and Automotive Engineering, having authored 17 papers that have together received 329 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (2 papers), Copper Interconnects and Reliability (1 paper), Management Systems and Quality Improvement (1 paper), Green IT and Sustainability (1 paper), Quality and Supply Management (1 paper), Vehicle Dynamics and Control Systems (1 paper) and Integrated Circuits and Semiconductor Failure Analysis (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (243 citations), Automotive Engineering (14 citations), Industrial and Manufacturing Engineering (12 citations), Statistics, Probability and Uncertainty (9 citations) and Hardware and Architecture (8 citations). Bob Willis has collaborated with scholars based in United Kingdom. Frequent co-authors include Davide Di Maio and Colin Henry Lea. Their work appears in journals such as Soldering and Surface Mount Technology, Microelectronics International and Circuit World.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.