Journal of Microelectronics and Electronic Packaging
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrical and Thermal Properties of Materials
- Silicon Carbide Semiconductor Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 165
- 3D IC and TSV technologies 132
- Electrical and Thermal Properties of Materials 56
- Electromagnetic Compatibility and Noise Suppression 30
- Silicon Carbide Semiconductor Technologies 27
- Microwave Dielectric Ceramics Synthesis 23
In The Last Decade
Journal of Microelectronics and Electronic Packaging
334 papers receiving 1.6k citations
Peers
Comparison fields: 5 of 81
- Electrical and Electronic Engineering 1.4k
- Automotive Engineering 129
- Biomedical Engineering 387
- Mechanical Engineering 301
- Materials Chemistry 309
Countries where authors publish in Journal of Microelectronics and Electronic Packaging
This map shows the geographic impact of research published in Journal of Microelectronics and Electronic Packaging. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in Journal of Microelectronics and Electronic Packaging with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Journal of Microelectronics and Electronic Packaging more than expected).
Fields of papers published in Journal of Microelectronics and Electronic Packaging
This network shows the impact of papers published in Journal of Microelectronics and Electronic Packaging. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in Journal of Microelectronics and Electronic Packaging.
About Journal of Microelectronics and Electronic Packaging
The 379 papers published in Journal of Microelectronics and Electronic Packaging in the last decades have received a total of 1.7k indexed citations . Papers published in Journal of Microelectronics and Electronic Packaging usually cover Electrical and Electronic Engineering (320 papers), Ceramics and Composites (16 papers), Automotive Engineering (28 papers), Mechanical Engineering (76 papers) and General Materials Science (6 papers) specifically the topics of Electronic Packaging and Soldering Technologies (165 papers), 3D IC and TSV technologies (132 papers), Electrical and Thermal Properties of Materials (56 papers), Ferroelectric and Piezoelectric Materials (32 papers), Electromagnetic Compatibility and Noise Suppression (30 papers), Silicon Carbide Semiconductor Technologies (27 papers), Additive Manufacturing and 3D Printing Technologies (26 papers) and Microwave Dielectric Ceramics Synthesis (23 papers). The most active scholars publishing in Journal of Microelectronics and Electronic Packaging are John H. Lau, Jianbiao Pan, Peter Rodgers, Liang-Yü Chen, F. Patrick McCluskey, E. H. Linfield, Jens Müller, Juan C. Nino, D. B. Tanner and R. Mittra.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.