S.A. Kuhn
Impact in
- Hardware and Architecture top 10%
-
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Low-power high-performance VLSI design
Papers in
-
- 3D IC and TSV technologies 4
- Advanced Memory and Neural Computing 3
- Silicon Carbide Semiconductor Technologies 2
- Low-power high-performance VLSI design 2
- CCD and CMOS Imaging Sensors 2
- Semiconductor materials and devices 2
-
- Parallel Computing and Optimization Techniques 5
- Co-authors
- M.B. Kleiner (12 shared papers)W. Weber (8 shared papers)Peter Ramm (4 shared papers)Werner Weber (2 shared papers)R. Thewes (1 shared paper)Johannes Weber (1 shared paper)
- Journals
- IEEE Transactions on Electron Devices (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)European Solid-State Device Research Conference (1 paper)International Symposium on Circuits and Systems (1 paper)
- Partner nations
- Germany
In The Last Decade
S.A. Kuhn
12 papers receiving 382 citations
Peers
Comparison fields: 5 of 38
- Hardware and Architecture 40
- Electrical and Electronic Engineering 260
- Mechanical Engineering 130
- Automotive Engineering 23
- Biomedical Engineering 71
Countries citing papers authored by S.A. Kuhn
This map shows the geographic impact of S.A. Kuhn's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.A. Kuhn with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.A. Kuhn more than expected).
Fields of papers citing papers by S.A. Kuhn
This network shows the impact of papers produced by S.A. Kuhn. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.A. Kuhn. The network helps show where S.A. Kuhn may publish in the future.
Co-authors
The 6 scholars most cited alongside S.A. Kuhn, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1995 | 122 | |
| 2 | 1996 | 85 | |
| 3 | 1995 | 50 | |
| 4 | 1996 | 34 | |
| 5 | Thermal Conductivity of Thin Silicon Dioxide Films in Integrated Circuits | 1995 | 31 |
| 6 | 2002 | 31 | |
| 7 | 1995 | 24 | |
| 8 | 1996 | 12 | |
| 9 | 2002 | 6 | |
| 10 | 2002 | 4 | |
| 11 | 2002 | 3 | |
| 12 | Performance Improvement of the Memory Hierarchy of RISC Systems by Applications of 3-D Technology. | 1995 | 1 |
About S.A. Kuhn
S.A. Kuhn is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Aerospace Engineering and Mechanical Engineering, having authored 12 papers that have together received 403 indexed citations. Recurring topics across this work include Parallel Computing and Optimization Techniques (5 papers), Interconnection Networks and Systems (4 papers), 3D IC and TSV technologies (4 papers), Advanced Memory and Neural Computing (3 papers), Silicon Carbide Semiconductor Technologies (2 papers), Low-power high-performance VLSI design (2 papers), CCD and CMOS Imaging Sensors (2 papers) and Semiconductor materials and devices (2 papers). The work is most often cited by research in Hardware and Architecture (40 citations), Electrical and Electronic Engineering (260 citations), Mechanical Engineering (130 citations), Automotive Engineering (23 citations) and Biomedical Engineering (71 citations). S.A. Kuhn has collaborated with scholars based in Germany. Frequent co-authors include M.B. Kleiner, W. Weber, Peter Ramm, Werner Weber, R. Thewes and Johannes Weber. Their work appears in journals such as IEEE Transactions on Electron Devices, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, IEEE Transactions on Components Packaging and Manufacturing Technology Part A, European Solid-State Device Research Conference and International Symposium on Circuits and Systems.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.