E. Suhir
Impact in
- Mechanics of Materials top 0.5%
- Mechanical Behavior of Composites
- Adhesion, Friction, and Surface Interactions
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced Fiber Optic Sensors
- Semiconductor Lasers and Optical Devices
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 101
- 3D IC and TSV technologies 57
- Advanced Fiber Optic Sensors 42
- Semiconductor Lasers and Optical Devices 31
- Integrated Circuits and Semiconductor Failure Analysis 21
-
- Mechanical Behavior of Composites 37
- Material Properties and Processing 20
- Adhesion, Friction, and Surface Interactions 18
- Co-authors
- Serge Luryi (1 shared paper)Xuejun Fan (1 shared paper)Reza Ghaffarian (13 shared papers)Ali Shakouri (4 shared papers)Yuan Xu (5 shared papers)Yi Zhang (5 shared papers)C.P. Wong (1 shared paper)Xinwei Wang (1 shared paper)
- Journals
- Journal of Electronic Packaging (23 papers)Journal of Materials Science Materials in Electronics (19 papers)Journal of Applied Mechanics (16 papers)Microelectronics Reliability (9 papers)International Journal of Solids and Structures (9 papers)
- Partner nations
- United StatesAustriaFrance
In The Last Decade
E. Suhir
298 papers receiving 4.3k citations
E. Suhir's Hit Papers
Peers
Comparison fields: 5 of 106
- Mechanics of Materials 1.5k
- Electrical and Electronic Engineering 3.0k
- Statistics, Probability and Uncertainty 255
- Medical Laboratory Technology 39
- Mechanical Engineering 823
Countries citing papers authored by E. Suhir
This map shows the geographic impact of E. Suhir's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Suhir with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Suhir more than expected).
Fields of papers citing papers by E. Suhir
This network shows the impact of papers produced by E. Suhir. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Suhir. The network helps show where E. Suhir may publish in the future.
Co-authors
The 25 scholars most cited alongside E. Suhir, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 308 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Stresses in Bi-Metal Thermostats Hit paper breakdown → | 1986 | 395 |
| 2 | 1986 | 298 | |
| 3 | 1989 | 264 | |
| 4 | 1988 | 183 | |
| 5 | 2010 | 109 | |
| 6 | 1991 | 93 | |
| 7 | 2006 | 86 | |
| 8 | Calculated thermally induced stresses in adhesively bonded and soldered assemblies. | 1986 | 83 |
| 9 | 2007 | 81 | |
| 10 | 2001 | 69 | |
| 11 | 1990 | 65 | |
| 12 | 2002 | 51 | |
| 13 | 1988 | 51 | |
| 14 | 1997 | 49 | |
| 15 | 2009 | 47 | |
| 16 | 1994 | 47 | |
| 17 | 2013 | 42 | |
| 18 | 2001 | 42 | |
| 19 | 2012 | 41 | |
| 20 | 2013 | 41 |
About E. Suhir
E. Suhir is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Statistics, Probability and Uncertainty and Biomedical Engineering, having authored 308 papers that have together received 4.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (101 papers), 3D IC and TSV technologies (57 papers), Advanced Fiber Optic Sensors (42 papers), Mechanical Behavior of Composites (37 papers), Semiconductor Lasers and Optical Devices (31 papers), Integrated Circuits and Semiconductor Failure Analysis (21 papers), Material Properties and Processing (20 papers) and Adhesion, Friction, and Surface Interactions (18 papers). The work is most often cited by research in Mechanics of Materials (1.5k citations), Electrical and Electronic Engineering (3.0k citations), Statistics, Probability and Uncertainty (255 citations), Medical Laboratory Technology (39 citations) and Mechanical Engineering (823 citations). E. Suhir has collaborated with scholars based in United States, Austria and France. Frequent co-authors include Serge Luryi, Xuejun Fan, Reza Ghaffarian, Ali Shakouri, Yuan Xu, Yi Zhang, C.P. Wong, Xinwei Wang, Seung‐Kyun Kang and J. Nicolics. Their work appears in journals such as Journal of Electronic Packaging, Journal of Materials Science Materials in Electronics, Journal of Applied Mechanics, Microelectronics Reliability and International Journal of Solids and Structures.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.