Tiwei Wei
Impact in
- Mechanical Engineering top 5%
- Heat Transfer and Optimization
- Heat Transfer Mechanisms
- Heat Transfer and Boiling Studies
- Computational Mechanics top 10%
- Fluid Dynamics and Turbulent Flows
Papers in
-
- Heat Transfer and Optimization 23
- Heat Transfer Mechanisms 22
- Heat Transfer and Boiling Studies 6
-
- 3D IC and TSV technologies 16
- Electronic Packaging and Soldering Technologies 12
- Semiconductor materials and devices 5
- Silicon Carbide Semiconductor Technologies 4
- Co-authors
- Eric Beyne (16 shared papers)Herman Oprins (16 shared papers)Vladimir Cherman (16 shared papers)Martine Baelmans (15 shared papers)Ingrid De Wolf (9 shared papers)Jun Qian (1 shared paper)Mehdi Asheghi (8 shared papers)Kenneth E. Goodson (7 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)International Journal of Heat and Mass Transfer (4 papers)Applied Thermal Engineering (3 papers)Journal of Electronic Packaging (2 papers)IEEE Transactions on Power Electronics (1 paper)
- Partner nations
- United StatesBelgiumChina
In The Last Decade
Tiwei Wei
42 papers receiving 542 citations
Peers
Comparison fields: 5 of 32
- Mechanical Engineering 358
- Computational Mechanics 109
- Electrical and Electronic Engineering 202
- Aerospace Engineering 73
- Automotive Engineering 25
Countries citing papers authored by Tiwei Wei
This map shows the geographic impact of Tiwei Wei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tiwei Wei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tiwei Wei more than expected).
Fields of papers citing papers by Tiwei Wei
This network shows the impact of papers produced by Tiwei Wei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tiwei Wei. The network helps show where Tiwei Wei may publish in the future.
Co-authors
The 25 scholars most cited alongside Tiwei Wei, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 52 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2019 | 71 | |
| 2 | 2019 | 48 | |
| 3 | 2019 | 40 | |
| 4 | 2019 | 37 | |
| 5 | 2017 | 29 | |
| 6 | 2023 | 22 | |
| 7 | 2022 | 21 | |
| 8 | 2020 | 20 | |
| 9 | 2019 | 20 | |
| 10 | 2021 | 20 | |
| 11 | 2019 | 19 | |
| 12 | 2018 | 19 | |
| 13 | 2020 | 18 | |
| 14 | 2014 | 17 | |
| 15 | 2022 | 15 | |
| 16 | 2022 | 14 | |
| 17 | 2014 | 14 | |
| 18 | 2012 | 10 | |
| 19 | 2025 | 8 | |
| 20 | 2020 | 8 |
About Tiwei Wei
Tiwei Wei is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Computational Mechanics, Biomedical Engineering and Aerospace Engineering, having authored 52 papers that have together received 547 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (23 papers), Heat Transfer Mechanisms (22 papers), 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (12 papers), Fluid Dynamics and Turbulent Flows (8 papers), Heat Transfer and Boiling Studies (6 papers), Semiconductor materials and devices (5 papers) and Silicon Carbide Semiconductor Technologies (4 papers). The work is most often cited by research in Mechanical Engineering (358 citations), Computational Mechanics (109 citations), Electrical and Electronic Engineering (202 citations), Aerospace Engineering (73 citations) and Automotive Engineering (25 citations). Tiwei Wei has collaborated with scholars based in United States, Belgium and China. Frequent co-authors include Eric Beyne, Herman Oprins, Vladimir Cherman, Martine Baelmans, Ingrid De Wolf, Jun Qian, Mehdi Asheghi, Kenneth E. Goodson, Man Prakash Gupta and M.W. Degner. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, International Journal of Heat and Mass Transfer, Applied Thermal Engineering, Journal of Electronic Packaging and IEEE Transactions on Power Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.