V. Bader
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
- Semiconductor Lasers and Optical Devices
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 28
- 3D IC and TSV technologies 25
- Electromagnetic Compatibility and Noise Suppression 3
- Semiconductor Lasers and Optical Devices 2
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- Additive Manufacturing and 3D Printing Technologies 6
- Co-authors
- R. Aschenbrenner (26 shared papers)Tanja Braun (22 shared papers)H. Reichl (17 shared papers)Matthias Koch (14 shared papers)K.-F. Becker (14 shared papers)Karl‐Friedrich Becker (14 shared papers)S. Voges (12 shared papers)R. Kahle (11 shared papers)
- Journals
- Microelectronics Reliability (2 papers)Journal of Electronic Packaging (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Fraunhofer-Publica (Fraunhofer-Gesellschaft) (10 papers)SPIE eBooks (1 paper)
In The Last Decade
V. Bader
33 papers receiving 361 citations
Peers
Comparison fields: 5 of 35
- Electrical and Electronic Engineering 346
- Automotive Engineering 47
- Industrial and Manufacturing Engineering 26
- Mechanics of Materials 58
- Electronic, Optical and Magnetic Materials 31
Countries citing papers authored by V. Bader
This map shows the geographic impact of V. Bader's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Bader with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Bader more than expected).
Fields of papers citing papers by V. Bader
This network shows the impact of papers produced by V. Bader. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Bader. The network helps show where V. Bader may publish in the future.
Co-authors
The 25 scholars most cited alongside V. Bader, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 60 | |
| 2 | 2005 | 41 | |
| 3 | 2011 | 32 | |
| 4 | 2005 | 22 | |
| 5 | 2012 | 20 | |
| 6 | 2014 | 18 | |
| 7 | 2002 | 17 | |
| 8 | Chip Size Package - The Option of Choice for Miniaturized Medical Devices | 1998 | 15 |
| 9 | 2005 | 14 | |
| 10 | 2015 | 13 | |
| 11 | 2006 | 13 | |
| 12 | 2002 | 12 | |
| 13 | 2005 | 12 | |
| 14 | 2014 | 12 | |
| 15 | 2016 | 11 | |
| 16 | 2002 | 11 | |
| 17 | 3D stacking approaches for mold embedded packages | 2011 | 10 |
| 18 | 2002 | 10 | |
| 19 | 2005 | 9 | |
| 20 | Chip size package - the option of choice for miniaturized medical devices | 1998 | 6 |
About V. Bader
V. Bader is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanics of Materials, Industrial and Manufacturing Engineering and Mechanical Engineering, having authored 36 papers that have together received 402 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (25 papers), Additive Manufacturing and 3D Printing Technologies (6 papers), Manufacturing Process and Optimization (4 papers), Material Properties and Processing (3 papers), Electromagnetic Compatibility and Noise Suppression (3 papers), Thermal properties of materials (3 papers) and Semiconductor Lasers and Optical Devices (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (346 citations), Automotive Engineering (47 citations), Industrial and Manufacturing Engineering (26 citations), Mechanics of Materials (58 citations) and Electronic, Optical and Magnetic Materials (31 citations). V. Bader has collaborated with scholars based in Germany and Taiwan. Frequent co-authors include R. Aschenbrenner, Tanja Braun, H. Reichl, Matthias Koch, K.-F. Becker, Karl‐Friedrich Becker, S. Voges, R. Kahle, T. Thomas and K.-D. Lang. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Packaging, IEEE Transactions on Electronics Packaging Manufacturing, Fraunhofer-Publica (Fraunhofer-Gesellschaft) and SPIE eBooks.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.