T. Thomas
Impact in
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- Microbial Inactivation Methods
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 15
- 3D IC and TSV technologies 10
- Electromagnetic Compatibility and Measurements 3
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- Additive Manufacturing and 3D Printing Technologies 6
- Co-authors
- Tanja Braun (20 shared papers)R. Aschenbrenner (15 shared papers)R. Kahle (12 shared papers)S. Voges (12 shared papers)K.-F. Becker (11 shared papers)J. Bauer (10 shared papers)K.-D. Lang (11 shared papers)Dietrich Knorr (1 shared paper)
- Journals
- Biomaterials (1 paper)Food Research International (1 paper)Philosophical Transactions of the Royal Society A Mathematical Physical and Engineering Sciences (1 paper)Microelectronics Reliability (1 paper)Proceedings of the National Academy of Sciences (1 paper)
- Partner nations
- GermanyTaiwanUnited States
In The Last Decade
T. Thomas
26 papers receiving 283 citations
Peers
Comparison fields: 5 of 52
- Biotechnology 38
- Electrical and Electronic Engineering 205
- Automotive Engineering 36
- Food Science 43
- Industrial and Manufacturing Engineering 22
Countries citing papers authored by T. Thomas
This map shows the geographic impact of T. Thomas's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Thomas with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Thomas more than expected).
Fields of papers citing papers by T. Thomas
This network shows the impact of papers produced by T. Thomas. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Thomas. The network helps show where T. Thomas may publish in the future.
Co-authors
The 25 scholars most cited alongside T. Thomas, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 53 | |
| 2 | 2015 | 49 | |
| 3 | 2013 | 30 | |
| 4 | 2011 | 29 | |
| 5 | 2010 | 20 | |
| 6 | 2012 | 18 | |
| 7 | 2014 | 14 | |
| 8 | 2015 | 13 | |
| 9 | 2014 | 12 | |
| 10 | 3D stacking approaches for mold embedded packages | 2011 | 10 |
| 11 | 2022 | 8 | |
| 12 | 2014 | 7 | |
| 13 | 2022 | 7 | |
| 14 | Reliability assessment of molded Smart Power Modules | 2014 | 5 |
| 15 | 2014 | 5 | |
| 16 | 2022 | 4 | |
| 17 | 2014 | 4 | |
| 18 | 2019 | 4 | |
| 19 | Fan-out Wafer Level Packaging for MEMS and Sensor Applications | 2014 | 4 |
| 20 | 2013 | 3 |
About T. Thomas
T. Thomas is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanical Engineering, Aerospace Engineering and Industrial and Manufacturing Engineering, having authored 28 papers that have together received 310 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (10 papers), Additive Manufacturing and 3D Printing Technologies (6 papers), Flexible and Reconfigurable Manufacturing Systems (3 papers), Antenna Design and Analysis (3 papers), Advanced Antenna and Metasurface Technologies (3 papers), Electromagnetic Compatibility and Measurements (3 papers) and Material Properties and Processing (3 papers). The work is most often cited by research in Biotechnology (38 citations), Electrical and Electronic Engineering (205 citations), Automotive Engineering (36 citations), Food Science (43 citations) and Industrial and Manufacturing Engineering (22 citations). T. Thomas has collaborated with scholars based in Germany, Taiwan and United States. Frequent co-authors include Tanja Braun, R. Aschenbrenner, R. Kahle, S. Voges, K.-F. Becker, J. Bauer, K.-D. Lang, Dietrich Knorr, V. Bader and Karl‐Friedrich Becker. Their work appears in journals such as Biomaterials, Food Research International, Philosophical Transactions of the Royal Society A Mathematical Physical and Engineering Sciences, Microelectronics Reliability and Proceedings of the National Academy of Sciences.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.