K.-F. Becker
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Microwave Engineering and Waveguides
- Advanced MEMS and NEMS Technologies
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- Neuroscience and Neural Engineering
Papers in
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- Electronic Packaging and Soldering Technologies 32
- 3D IC and TSV technologies 20
- Advanced MEMS and NEMS Technologies 2
- Integrated Circuits and Semiconductor Failure Analysis 1
- Electrowetting and Microfluidic Technologies 1
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- Digital Transformation in Industry 1
- Co-authors
- Rolf Aschenbrenner (35 shared papers)Tanja Braun (34 shared papers)Ruben Kahle (15 shared papers)S. Voges (13 shared papers)K. Dieter Lang (12 shared papers)Volker Bader (17 shared papers)Jens Bauer (16 shared papers)H. Reichl (25 shared papers)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Journal of Electronic Packaging (1 paper)IEEE Transactions on Advanced Packaging (1 paper)Microsystem Technologies (1 paper)Journal of Microelectronics and Electronic Packaging (1 paper)
- Partner nations
- GermanyUnited StatesItaly
In The Last Decade
K.-F. Becker
44 papers receiving 393 citations
Peers
Comparison fields: 5 of 27
- Electrical and Electronic Engineering 416
- Cellular and Molecular Neuroscience 14
- Mechanical Engineering 24
- Mechanics of Materials 13
- Aerospace Engineering 15
Countries citing papers authored by K.-F. Becker
This map shows the geographic impact of K.-F. Becker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K.-F. Becker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K.-F. Becker more than expected).
Fields of papers citing papers by K.-F. Becker
This network shows the impact of papers produced by K.-F. Becker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K.-F. Becker. The network helps show where K.-F. Becker may publish in the future.
Co-authors
The 25 scholars most cited alongside K.-F. Becker, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 49 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 65 | |
| 2 | 2013 | 39 | |
| 3 | 2011 | 34 | |
| 4 | 2004 | 29 | |
| 5 | 2017 | 28 | |
| 6 | 2010 | 24 | |
| 7 | 2006 | 22 | |
| 8 | 2012 | 20 | |
| 9 | 2014 | 20 | |
| 10 | 2015 | 19 | |
| 11 | 2005 | 14 | |
| 12 | 2002 | 12 | |
| 13 | 2005 | 12 | |
| 14 | 2000 | 11 | |
| 15 | 2016 | 11 | |
| 16 | 2008 | 10 | |
| 17 | 3D stacking approaches for mold embedded packages | 2011 | 10 |
| 18 | 2005 | 8 | |
| 19 | 2001 | 7 | |
| 20 | 2010 | 7 |
About K.-F. Becker
K.-F. Becker is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Safety, Risk, Reliability and Quality, Biomedical Engineering and Cellular and Molecular Neuroscience, having authored 49 papers that have together received 470 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (20 papers), Advanced MEMS and NEMS Technologies (2 papers), Microfluidic and Bio-sensing Technologies (2 papers), Integrated Circuits and Semiconductor Failure Analysis (1 paper), Digital Transformation in Industry (1 paper), Radar Systems and Signal Processing (1 paper) and Electrowetting and Microfluidic Technologies (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (416 citations), Cellular and Molecular Neuroscience (14 citations), Mechanical Engineering (24 citations), Mechanics of Materials (13 citations) and Aerospace Engineering (15 citations). K.-F. Becker has collaborated with scholars based in Germany, United States and Italy. Frequent co-authors include Rolf Aschenbrenner, Tanja Braun, Ruben Kahle, S. Voges, K. Dieter Lang, Volker Bader, Jens Bauer, H. Reichl, Matthias Albert Koch and Andreas Ostmann. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, Journal of Electronic Packaging, IEEE Transactions on Advanced Packaging, Microsystem Technologies and Journal of Microelectronics and Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.