K.-F. Becker
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 28
- Electronic Packaging and Soldering Technologies 26
- Electromagnetic Compatibility and Noise Suppression 3
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- Additive Manufacturing and 3D Printing Technologies 10
- Co-authors
- R. Aschenbrenner (31 shared papers)Tanja Braun (31 shared papers)S. Voges (11 shared papers)R. Kahle (13 shared papers)H. Reichl (23 shared papers)T. Thomas (11 shared papers)V. Bader (14 shared papers)K.-D. Lang (11 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (1 paper)Macromolecular Symposia (1 paper)Journal of Electronic Packaging (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Fraunhofer-Publica (Fraunhofer-Gesellschaft) (9 papers)
- Partner nations
- GermanyTaiwanUnited States
In The Last Decade
K.-F. Becker
42 papers receiving 391 citations
Peers
Comparison fields: 5 of 39
- Electrical and Electronic Engineering 386
- Automotive Engineering 58
- Industrial and Manufacturing Engineering 38
- Mechanics of Materials 51
- Electronic, Optical and Magnetic Materials 36
Countries citing papers authored by K.-F. Becker
This map shows the geographic impact of K.-F. Becker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K.-F. Becker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K.-F. Becker more than expected).
Fields of papers citing papers by K.-F. Becker
This network shows the impact of papers produced by K.-F. Becker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K.-F. Becker. The network helps show where K.-F. Becker may publish in the future.
Co-authors
The 25 scholars most cited alongside K.-F. Becker, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 44 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 60 | |
| 2 | 2013 | 37 | |
| 3 | 2011 | 32 | |
| 4 | 2004 | 31 | |
| 5 | 2017 | 28 | |
| 6 | 2010 | 24 | |
| 7 | 2006 | 23 | |
| 8 | 2012 | 20 | |
| 9 | 2015 | 18 | |
| 10 | 2014 | 18 | |
| 11 | 2005 | 14 | |
| 12 | 2002 | 12 | |
| 13 | 2005 | 12 | |
| 14 | 2016 | 11 | |
| 15 | 2000 | 11 | |
| 16 | 3D stacking approaches for mold embedded packages | 2011 | 10 |
| 17 | 2005 | 9 | |
| 18 | 2001 | 7 | |
| 19 | 2010 | 7 | |
| 20 | 2008 | 6 |
About K.-F. Becker
K.-F. Becker is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanics of Materials, Industrial and Manufacturing Engineering and Mechanical Engineering, having authored 44 papers that have together received 451 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (26 papers), Additive Manufacturing and 3D Printing Technologies (10 papers), Material Properties and Processing (4 papers), Flexible and Reconfigurable Manufacturing Systems (3 papers), Injection Molding Process and Properties (3 papers), Manufacturing Process and Optimization (3 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (386 citations), Automotive Engineering (58 citations), Industrial and Manufacturing Engineering (38 citations), Mechanics of Materials (51 citations) and Electronic, Optical and Magnetic Materials (36 citations). K.-F. Becker has collaborated with scholars based in Germany, Taiwan and United States. Frequent co-authors include R. Aschenbrenner, Tanja Braun, S. Voges, R. Kahle, H. Reichl, T. Thomas, V. Bader, K.-D. Lang, J. Bauer and Matthias Koch. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Macromolecular Symposia, Journal of Electronic Packaging, IEEE Transactions on Electronics Packaging Manufacturing and Fraunhofer-Publica (Fraunhofer-Gesellschaft).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.