Su‐Tsai Lu
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 29
- 3D IC and TSV technologies 28
- Integrated Circuits and Semiconductor Failure Analysis 3
-
- Additive Manufacturing and 3D Printing Technologies 8
- Co-authors
- Wen‐Hwa Chen (15 shared papers)Hsien‐Chie Cheng (10 shared papers)Tai‐Hong Chen (10 shared papers)Chau‐Jie Zhan (5 shared papers)Tao‐Chih Chang (1 shared paper)Yu-Min Lin (5 shared papers)John H. Lau (2 shared papers)Yuhua Chen (2 shared papers)
- Journals
- IEEE Transactions on Device and Materials Reliability (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Journal of Electronic Materials (2 papers)Microelectronics Reliability (2 papers)IEEE Transactions on Advanced Packaging (1 paper)
- Partner nations
- TaiwanUnited States
In The Last Decade
Su‐Tsai Lu
30 papers receiving 359 citations
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 322
- Automotive Engineering 67
- Mechanical Engineering 103
- Electronic, Optical and Magnetic Materials 37
- Mechanics of Materials 48
Countries citing papers authored by Su‐Tsai Lu
This map shows the geographic impact of Su‐Tsai Lu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Su‐Tsai Lu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Su‐Tsai Lu more than expected).
Fields of papers citing papers by Su‐Tsai Lu
This network shows the impact of papers produced by Su‐Tsai Lu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Su‐Tsai Lu. The network helps show where Su‐Tsai Lu may publish in the future.
Co-authors
The 25 scholars most cited alongside Su‐Tsai Lu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 32 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 58 | |
| 2 | 2010 | 45 | |
| 3 | 2011 | 26 | |
| 4 | 2012 | 25 | |
| 5 | 2013 | 24 | |
| 6 | 2010 | 21 | |
| 7 | 2013 | 19 | |
| 8 | 2012 | 18 | |
| 9 | 2015 | 14 | |
| 10 | 2006 | 12 | |
| 11 | 2008 | 10 | |
| 12 | 2010 | 10 | |
| 13 | 2012 | 10 | |
| 14 | 2010 | 10 | |
| 15 | 2017 | 8 | |
| 16 | 2010 | 7 | |
| 17 | 2010 | 7 | |
| 18 | 2010 | 7 | |
| 19 | 2006 | 6 | |
| 20 | 2012 | 5 |
About Su‐Tsai Lu
Su‐Tsai Lu is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanical Engineering, Mechanics of Materials and Biomedical Engineering, having authored 32 papers that have together received 369 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (28 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Nanofabrication and Lithography Techniques (4 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Adhesion, Friction, and Surface Interactions (3 papers), Advanced Welding Techniques Analysis (2 papers) and Epoxy Resin Curing Processes (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (322 citations), Automotive Engineering (67 citations), Mechanical Engineering (103 citations), Electronic, Optical and Magnetic Materials (37 citations) and Mechanics of Materials (48 citations). Su‐Tsai Lu has collaborated with scholars based in Taiwan and United States. Frequent co-authors include Wen‐Hwa Chen, Hsien‐Chie Cheng, Tai‐Hong Chen, Chau‐Jie Zhan, Tao‐Chih Chang, Yu-Min Lin, John H. Lau, Yuhua Chen, Wei‐Chung Lo and Tsung‐Fu Yang. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Materials, Microelectronics Reliability and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.