Myung-Jin Yim
About
Myung-Jin Yim has authored 12 papers that have received a total of 360 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 3 papers in Biomedical Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers) and Advanced Sensor and Energy Harvesting Materials (3 papers). Myung-Jin Yim is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers) and Advanced Sensor and Energy Harvesting Materials (3 papers) and collaborates with scholars based in South Korea, United States and Singapore. Myung-Jin Yim's co-authors include Kyung-Wook Paik, Kyung‐Wook Paik, Jun-Ho Lee, Jin-Sang Hwang and Hyoung-Joon Kim and has published in prestigious journals such as Journal of Electronic Materials, IEEE Transactions on Components and Packaging Technologies and Journal of Electronic Packaging.
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