K.-D. Lang
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Advancements in Battery Materials
- Semiconductor materials and devices
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
- Advanced Battery Technologies Research
Papers in
-
- 3D IC and TSV technologies 22
- Electronic Packaging and Soldering Technologies 20
- Electromagnetic Compatibility and Noise Suppression 4
-
- Additive Manufacturing and 3D Printing Technologies 7
- Advanced Battery Technologies Research 4
- Co-authors
- R. Aschenbrenner (23 shared papers)S. Voges (13 shared papers)Tanja Braun (14 shared papers)T. Thomas (11 shared papers)K.-F. Becker (10 shared papers)J. Bauer (10 shared papers)R. Kahle (10 shared papers)Robert Hahn (6 shared papers)
- Journals
- Microelectronics Reliability (2 papers)Journal of Power Sources (1 paper)Surface and Coatings Technology (1 paper)International Journal of Hydrogen Energy (1 paper)Journal of Physics Conference Series (2 papers)
In The Last Decade
K.-D. Lang
44 papers receiving 402 citations
Peers
Comparison fields: 5 of 48
- Electrical and Electronic Engineering 346
- Automotive Engineering 69
- Electronic, Optical and Magnetic Materials 46
- Mechanics of Materials 51
- Industrial and Manufacturing Engineering 19
Countries citing papers authored by K.-D. Lang
This map shows the geographic impact of K.-D. Lang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K.-D. Lang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K.-D. Lang more than expected).
Fields of papers citing papers by K.-D. Lang
This network shows the impact of papers produced by K.-D. Lang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K.-D. Lang. The network helps show where K.-D. Lang may publish in the future.
Co-authors
The 25 scholars most cited alongside K.-D. Lang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 48 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 49 | |
| 2 | 2015 | 45 | |
| 3 | 2005 | 32 | |
| 4 | 2013 | 30 | |
| 5 | 2011 | 29 | |
| 6 | 2017 | 25 | |
| 7 | 2012 | 18 | |
| 8 | 2015 | 16 | |
| 9 | 2014 | 14 | |
| 10 | 2012 | 12 | |
| 11 | 2014 | 12 | |
| 12 | 3D stacking approaches for mold embedded packages | 2011 | 10 |
| 13 | 2013 | 10 | |
| 14 | 2012 | 10 | |
| 15 | 2014 | 9 | |
| 16 | Power modules with embedded components | 2014 | 9 |
| 17 | 2011 | 9 | |
| 18 | 2014 | 7 | |
| 19 | 2014 | 6 | |
| 20 | 2016 | 5 |
About K.-D. Lang
K.-D. Lang is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanics of Materials, Mechanical Engineering and Industrial and Manufacturing Engineering, having authored 48 papers that have together received 433 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (20 papers), Additive Manufacturing and 3D Printing Technologies (7 papers), Advanced Battery Technologies Research (4 papers), Manufacturing Process and Optimization (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Antenna Design and Analysis (3 papers) and Adhesion, Friction, and Surface Interactions (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (346 citations), Automotive Engineering (69 citations), Electronic, Optical and Magnetic Materials (46 citations), Mechanics of Materials (51 citations) and Industrial and Manufacturing Engineering (19 citations). K.-D. Lang has collaborated with scholars based in Germany, Cyprus and Finland. Frequent co-authors include R. Aschenbrenner, S. Voges, Tanja Braun, T. Thomas, K.-F. Becker, J. Bauer, R. Kahle, Robert Hahn, V. Bader and A. Heft. Their work appears in journals such as Microelectronics Reliability, Journal of Power Sources, Surface and Coatings Technology, International Journal of Hydrogen Energy and Journal of Physics Conference Series.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.