Andreas Ostmann
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Mechanical Engineering top 10%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
Papers in
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- 3D IC and TSV technologies 87
- Electronic Packaging and Soldering Technologies 73
- Semiconductor Lasers and Optical Devices 14
- Electromagnetic Compatibility and Noise Suppression 14
- Silicon Carbide Semiconductor Technologies 10
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- Additive Manufacturing and 3D Printing Technologies 21
- Co-authors
- H. Reichl (63 shared papers)R. Aschenbrenner (50 shared papers)Dionysios Manessis (48 shared papers)Thomas Löher (20 shared papers)Erik Jung (19 shared papers)Eckart Hoene (5 shared papers)Alexander Neumann (15 shared papers)Mingliang Huang (2 shared papers)
- Journals
- Microelectronics Reliability (2 papers)Journal of Electronic Materials (2 papers)Applied Physics Letters (1 paper)Microsystem Technologies (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)
- Partner nations
- GermanySouth KoreaUnited States
In The Last Decade
Andreas Ostmann
125 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 61
- Electrical and Electronic Engineering 1.2k
- Mechanical Engineering 343
- Automotive Engineering 89
- Biomedical Engineering 296
- Electronic, Optical and Magnetic Materials 103
Countries citing papers authored by Andreas Ostmann
This map shows the geographic impact of Andreas Ostmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andreas Ostmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andreas Ostmann more than expected).
Fields of papers citing papers by Andreas Ostmann
This network shows the impact of papers produced by Andreas Ostmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andreas Ostmann. The network helps show where Andreas Ostmann may publish in the future.
Co-authors
The 25 scholars most cited alongside Andreas Ostmann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 136 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 77 | |
| 2 | 2003 | 60 | |
| 3 | Packaging Very Fast Switching Semiconductors | 2014 | 56 |
| 4 | 2003 | 48 | |
| 5 | Ultra-Low-Inductance Power Module for Fast Switching Semiconductors | 2013 | 47 |
| 6 | 2003 | 44 | |
| 7 | 1997 | 44 | |
| 8 | 2008 | 38 | |
| 9 | 2009 | 37 | |
| 10 | 2008 | 36 | |
| 11 | 2007 | 32 | |
| 12 | 1992 | 31 | |
| 13 | 2004 | 31 | |
| 14 | 2003 | 31 | |
| 15 | 2022 | 30 | |
| 16 | 2010 | 27 | |
| 17 | 2006 | 25 | |
| 18 | 2010 | 24 | |
| 19 | 2002 | 24 | |
| 20 | 2000 | 23 |
About Andreas Ostmann
Andreas Ostmann is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanical Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 136 papers that have together received 1.4k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (87 papers), Electronic Packaging and Soldering Technologies (73 papers), Additive Manufacturing and 3D Printing Technologies (21 papers), Semiconductor Lasers and Optical Devices (14 papers), Electromagnetic Compatibility and Noise Suppression (14 papers), Advanced Sensor and Energy Harvesting Materials (11 papers), Silicon Carbide Semiconductor Technologies (10 papers) and Advanced Materials and Mechanics (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.2k citations), Mechanical Engineering (343 citations), Automotive Engineering (89 citations), Biomedical Engineering (296 citations) and Electronic, Optical and Magnetic Materials (103 citations). Andreas Ostmann has collaborated with scholars based in Germany, South Korea and United States. Frequent co-authors include H. Reichl, R. Aschenbrenner, Dionysios Manessis, Thomas Löher, Erik Jung, Eckart Hoene, Alexander Neumann, Mingliang Huang, Young-Doo Jeon and Kyung‐Wook Paik. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Materials, Applied Physics Letters, Microsystem Technologies and IEEE Transactions on Electronics Packaging Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.