Andreas Ostmann
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
- Nanomaterials and Printing Technologies
- Advanced MEMS and NEMS Technologies
- Microwave Engineering and Waveguides
- Electrodeposition and Electroless Coatings
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- Advanced Sensor and Energy Harvesting Materials
Papers in
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- Electronic Packaging and Soldering Technologies 88
- 3D IC and TSV technologies 45
- Silicon Carbide Semiconductor Technologies 17
- Nanomaterials and Printing Technologies 11
- Microwave Engineering and Waveguides 8
- Electrodeposition and Electroless Coatings 3
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- Advanced Antenna and Metasurface Technologies 4
- Antenna Design and Analysis 4
- Co-authors
- H. Reichl (62 shared papers)Rolf Aschenbrenner (50 shared papers)Dionysios Manessis (46 shared papers)Lars Boettcher (21 shared papers)Thomas Löher (20 shared papers)Eckart Hoene (5 shared papers)Erik Jung (19 shared papers)Mingliang L. Huang (2 shared papers)
- Journals
- Microelectronics Reliability (2 papers)Journal of Electronic Materials (2 papers)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Applied Physics Letters (1 paper)
- Partner nations
- GermanySouth KoreaBelgium
In The Last Decade
Andreas Ostmann
123 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 49
- Electrical and Electronic Engineering 1.3k
- Biomedical Engineering 114
- Condensed Matter Physics 34
- Electronic, Optical and Magnetic Materials 44
- General Materials Science 7
Countries citing papers authored by Andreas Ostmann
This map shows the geographic impact of Andreas Ostmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andreas Ostmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andreas Ostmann more than expected).
Fields of papers citing papers by Andreas Ostmann
This network shows the impact of papers produced by Andreas Ostmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andreas Ostmann. The network helps show where Andreas Ostmann may publish in the future.
Co-authors
The 25 scholars most cited alongside Andreas Ostmann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 134 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 78 | |
| 2 | 2003 | 60 | |
| 3 | Packaging Very Fast Switching Semiconductors | 2014 | 57 |
| 4 | Ultra-Low-Inductance Power Module for Fast Switching Semiconductors | 2013 | 50 |
| 5 | 2003 | 48 | |
| 6 | 2003 | 44 | |
| 7 | 1997 | 41 | |
| 8 | 2008 | 39 | |
| 9 | 2009 | 37 | |
| 10 | 2008 | 36 | |
| 11 | 2022 | 35 | |
| 12 | 2007 | 32 | |
| 13 | 1992 | 31 | |
| 14 | 2003 | 31 | |
| 15 | 2010 | 31 | |
| 16 | 2004 | 29 | |
| 17 | 2006 | 24 | |
| 18 | 2010 | 24 | |
| 19 | 2000 | 23 | |
| 20 | 2002 | 23 |
About Andreas Ostmann
Andreas Ostmann is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials and Bioengineering, having authored 134 papers that have together received 1.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (88 papers), 3D IC and TSV technologies (45 papers), Silicon Carbide Semiconductor Technologies (17 papers), Nanomaterials and Printing Technologies (11 papers), Microwave Engineering and Waveguides (8 papers), Advanced Antenna and Metasurface Technologies (4 papers), Antenna Design and Analysis (4 papers) and Electrodeposition and Electroless Coatings (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.3k citations), Biomedical Engineering (114 citations), Condensed Matter Physics (34 citations), Electronic, Optical and Magnetic Materials (44 citations) and General Materials Science (7 citations). Andreas Ostmann has collaborated with scholars based in Germany, South Korea and Belgium. Frequent co-authors include H. Reichl, Rolf Aschenbrenner, Dionysios Manessis, Lars Boettcher, Thomas Löher, Eckart Hoene, Erik Jung, Mingliang L. Huang, Kyung‐Wook Paik and Young-Doo Jeon. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Materials, IEEE Transactions on Electronics Packaging Manufacturing, IEEE Transactions on Components Packaging and Manufacturing Technology and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.