S. Voges
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Microwave Engineering and Waveguides
- Advanced MEMS and NEMS Technologies
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 27
- Electronic Packaging and Soldering Technologies 21
- Electromagnetic Compatibility and Noise Suppression 7
- Advanced MEMS and NEMS Technologies 2
- Semiconductor Lasers and Optical Devices 2
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- Manufacturing Process and Optimization 6
- Flexible and Reconfigurable Manufacturing Systems 3
- Co-authors
- Tanja Braun (32 shared papers)R. Kahle (20 shared papers)R. Aschenbrenner (24 shared papers)K.-D. Lang (13 shared papers)T. Thomas (12 shared papers)K.-F. Becker (10 shared papers)Karl‐Friedrich Becker (22 shared papers)J. Bauer (10 shared papers)
- Journals
- Micromachines (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (1 paper)IMAPSource Proceedings (8 papers)Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) (9 papers)Fraunhofer-Publica (Fraunhofer-Gesellschaft) (15 papers)
- Partner nations
- GermanyUnited StatesTaiwan
In The Last Decade
S. Voges
30 papers receiving 357 citations
Peers
Comparison fields: 5 of 36
- Electrical and Electronic Engineering 349
- Automotive Engineering 52
- Industrial and Manufacturing Engineering 32
- Electronic, Optical and Magnetic Materials 37
- Mechanics of Materials 46
Countries citing papers authored by S. Voges
This map shows the geographic impact of S. Voges's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Voges with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Voges more than expected).
Fields of papers citing papers by S. Voges
This network shows the impact of papers produced by S. Voges. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Voges. The network helps show where S. Voges may publish in the future.
Co-authors
The 25 scholars most cited alongside S. Voges, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 49 | |
| 2 | 2019 | 36 | |
| 3 | 2013 | 30 | |
| 4 | 2011 | 29 | |
| 5 | 2018 | 28 | |
| 6 | 2017 | 25 | |
| 7 | 2012 | 18 | |
| 8 | 2018 | 16 | |
| 9 | 2015 | 16 | |
| 10 | 2019 | 14 | |
| 11 | 2014 | 14 | |
| 12 | 2015 | 13 | |
| 13 | 2014 | 12 | |
| 14 | 2019 | 11 | |
| 15 | 3D stacking approaches for mold embedded packages | 2011 | 10 |
| 16 | 2016 | 10 | |
| 17 | 2020 | 10 | |
| 18 | 2022 | 9 | |
| 19 | 2017 | 8 | |
| 20 | 2017 | 7 |
About S. Voges
S. Voges is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Automotive Engineering, Mechanics of Materials and Mechanical Engineering, having authored 36 papers that have together received 400 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (27 papers), Electronic Packaging and Soldering Technologies (21 papers), Electromagnetic Compatibility and Noise Suppression (7 papers), Manufacturing Process and Optimization (6 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Flexible and Reconfigurable Manufacturing Systems (3 papers), Advanced MEMS and NEMS Technologies (2 papers) and Semiconductor Lasers and Optical Devices (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (349 citations), Automotive Engineering (52 citations), Industrial and Manufacturing Engineering (32 citations), Electronic, Optical and Magnetic Materials (37 citations) and Mechanics of Materials (46 citations). S. Voges has collaborated with scholars based in Germany, United States and Taiwan. Frequent co-authors include Tanja Braun, R. Kahle, R. Aschenbrenner, K.-D. Lang, T. Thomas, K.-F. Becker, Karl‐Friedrich Becker, J. Bauer, V. Bader and Martin Schneider‐Ramelow. Their work appears in journals such as Micromachines, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), IMAPSource Proceedings, Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) and Fraunhofer-Publica (Fraunhofer-Gesellschaft).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.