Bernhard Wunderle
Impact in
- Mechanics of Materials top 1%
- Mechanical Behavior of Composites
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 142
- 3D IC and TSV technologies 58
- Integrated Circuits and Semiconductor Failure Analysis 37
- Silicon Carbide Semiconductor Technologies 32
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- Mechanical Behavior of Composites 50
- Thermography and Photoacoustic Techniques 34
- Co-authors
- B. Michel (79 shared papers)H. Reichl (35 shared papers)Thomas Brunschwiler (14 shared papers)Hermann Oppermann (16 shared papers)Bruno Michel (6 shared papers)H. Pape (23 shared papers)Mohamad Abo Ras (57 shared papers)U. Kloter (3 shared papers)
- Journals
- Microelectronics Reliability (22 papers)Microsystem Technologies (8 papers)physica status solidi (a) (5 papers)Journal of Electronic Packaging (3 papers)Advanced Engineering Materials (2 papers)
- Partner nations
- GermanyNetherlandsFrance
In The Last Decade
Bernhard Wunderle
295 papers receiving 2.7k citations
Peers
Comparison fields: 5 of 78
- Mechanics of Materials 797
- Electrical and Electronic Engineering 1.8k
- Mechanical Engineering 877
- Biomedical Engineering 462
- Polymers and Plastics 137
Countries citing papers authored by Bernhard Wunderle
This map shows the geographic impact of Bernhard Wunderle's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bernhard Wunderle with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bernhard Wunderle more than expected).
Fields of papers citing papers by Bernhard Wunderle
This network shows the impact of papers produced by Bernhard Wunderle. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bernhard Wunderle. The network helps show where Bernhard Wunderle may publish in the future.
Co-authors
The 25 scholars most cited alongside Bernhard Wunderle, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 314 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 170 | |
| 2 | 2008 | 98 | |
| 3 | 2008 | 93 | |
| 4 | 2008 | 66 | |
| 5 | 2013 | 64 | |
| 6 | 2009 | 55 | |
| 7 | 2006 | 52 | |
| 8 | 2016 | 52 | |
| 9 | 2021 | 51 | |
| 10 | 2010 | 49 | |
| 11 | 2009 | 37 | |
| 12 | 2022 | 34 | |
| 13 | 2015 | 34 | |
| 14 | 2018 | 33 | |
| 15 | 2022 | 32 | |
| 16 | 2017 | 30 | |
| 17 | 2010 | 28 | |
| 18 | 2006 | 26 | |
| 19 | 2012 | 25 | |
| 20 | 2010 | 25 |
About Bernhard Wunderle
Bernhard Wunderle is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Materials Chemistry and Biomedical Engineering, having authored 314 papers that have together received 2.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (142 papers), 3D IC and TSV technologies (58 papers), Mechanical Behavior of Composites (50 papers), Integrated Circuits and Semiconductor Failure Analysis (37 papers), Thermal properties of materials (36 papers), Thermography and Photoacoustic Techniques (34 papers), Silicon Carbide Semiconductor Technologies (32 papers) and Force Microscopy Techniques and Applications (27 papers). The work is most often cited by research in Mechanics of Materials (797 citations), Electrical and Electronic Engineering (1.8k citations), Mechanical Engineering (877 citations), Biomedical Engineering (462 citations) and Polymers and Plastics (137 citations). Bernhard Wunderle has collaborated with scholars based in Germany, Netherlands and France. Frequent co-authors include B. Michel, H. Reichl, Thomas Brunschwiler, Hermann Oppermann, Bruno Michel, H. Pape, Mohamad Abo Ras, U. Kloter, H. Rothuizen and D. May. Their work appears in journals such as Microelectronics Reliability, Microsystem Technologies, physica status solidi (a), Journal of Electronic Packaging and Advanced Engineering Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.