E. Zakel
Impact in
- General Materials Science top 5%
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor Lasers and Optical Devices
- Electrodeposition and Electroless Coatings
Papers in
-
- Electronic Packaging and Soldering Technologies 42
- 3D IC and TSV technologies 34
- Semiconductor Lasers and Optical Devices 5
-
- Advanced Welding Techniques Analysis 5
- Aluminum Alloys Composites Properties 3
- Co-authors
- H. Reichl (32 shared papers)Andreas Ostmann (6 shared papers)R. Aschenbrenner (5 shared papers)S. Weiß (4 shared papers)B. Peplinski (1 shared paper)Erik Jung (4 shared papers)Christine Kallmayer (3 shared papers)Hermann Oppermann (2 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B (3 papers)Soldering and Surface Mount Technology (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)ECS Transactions (1 paper)Materials science forum (1 paper)
- Partner nations
- Germany
In The Last Decade
E. Zakel
47 papers receiving 390 citations
Peers
Comparison fields: 5 of 39
- General Materials Science 24
- Electrical and Electronic Engineering 423
- Mechanics of Materials 83
- Mechanical Engineering 125
- Computational Mechanics 31
Countries citing papers authored by E. Zakel
This map shows the geographic impact of E. Zakel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Zakel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Zakel more than expected).
Fields of papers citing papers by E. Zakel
This network shows the impact of papers produced by E. Zakel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Zakel. The network helps show where E. Zakel may publish in the future.
Co-authors
The 19 scholars most cited alongside E. Zakel, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 51 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1997 | 44 | |
| 2 | 1996 | 26 | |
| 3 | 2002 | 25 | |
| 4 | 2002 | 24 | |
| 5 | 2002 | 24 | |
| 6 | 1993 | 22 | |
| 7 | 1995 | 22 | |
| 8 | 2002 | 19 | |
| 9 | 2002 | 19 | |
| 10 | 2006 | 18 | |
| 11 | 1992 | 15 | |
| 12 | 1996 | 14 | |
| 13 | 1990 | 13 | |
| 14 | 1994 | 13 | |
| 15 | Low Cost Flip Chip Technologies Based on Chemical Nickel Bumping and Solder Printing | 1996 | 11 |
| 16 | 1994 | 10 | |
| 17 | A LOW COST BUMPING PROCESS FOR FLIP CHIP-TECHNOLOGY USING ELECTROLESS NICKEL BUMPING AND SOLDER BALL PLACEMENT | 1997 | 10 |
| 18 | 2002 | 10 | |
| 19 | 1994 | 9 | |
| 20 | 2002 | 9 |
About E. Zakel
E. Zakel is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Automotive Engineering, having authored 51 papers that have together received 467 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (34 papers), Adhesion, Friction, and Surface Interactions (12 papers), Semiconductor materials and interfaces (5 papers), Semiconductor Lasers and Optical Devices (5 papers), Advanced Welding Techniques Analysis (5 papers), Aluminum Alloys Composites Properties (3 papers) and Advanced Surface Polishing Techniques (3 papers). The work is most often cited by research in General Materials Science (24 citations), Electrical and Electronic Engineering (423 citations), Mechanics of Materials (83 citations), Mechanical Engineering (125 citations) and Computational Mechanics (31 citations). E. Zakel has collaborated with scholars based in Germany. Frequent co-authors include H. Reichl, Andreas Ostmann, R. Aschenbrenner, S. Weiß, B. Peplinski, Erik Jung, Christine Kallmayer, Hermann Oppermann, Walter Schmidt and Ralf Schulz. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Soldering and Surface Mount Technology, IEEE Transactions on Components Packaging and Manufacturing Technology Part A, ECS Transactions and Materials science forum.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.