E Perfecto
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
Papers in
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- 3D IC and TSV technologies 41
- Electronic Packaging and Soldering Technologies 38
- Integrated Circuits and Semiconductor Failure Analysis 6
- Semiconductor materials and devices 5
- VLSI and FPGA Design Techniques 4
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- Copper Interconnects and Reliability 12
- Co-authors
- K. Prasad (3 shared papers)Jae-Woong Nah (3 shared papers)Anupam Giri (3 shared papers)Minhua Lu (5 shared papers)G. Edward White (5 shared papers)E. J. Cotts (5 shared papers)Katsuyuki Sakuma (3 shared papers)A. Deutsch (4 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (2 papers)IBM Journal of Research and Development (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (4 papers)IEEE Transactions on Components Hybrids and Manufacturing Technology (1 paper)ECS Meeting Abstracts (1 paper)
- Partner nations
- United StatesCanadaJapan
In The Last Decade
E Perfecto
42 papers receiving 264 citations
Peers
Comparison fields: 5 of 35
- Electrical and Electronic Engineering 243
- Hardware and Architecture 18
- Polymers and Plastics 28
- Electronic, Optical and Magnetic Materials 35
- Mechanical Engineering 63
Countries citing papers authored by E Perfecto
This map shows the geographic impact of E Perfecto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E Perfecto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E Perfecto more than expected).
Fields of papers citing papers by E Perfecto
This network shows the impact of papers produced by E Perfecto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E Perfecto. The network helps show where E Perfecto may publish in the future.
Co-authors
The 25 scholars most cited alongside E Perfecto, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 49 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1994 | 25 | |
| 2 | 2014 | 22 | |
| 3 | 1994 | 20 | |
| 4 | 2012 | 17 | |
| 5 | 2008 | 16 | |
| 6 | 1998 | 15 | |
| 7 | 2008 | 15 | |
| 8 | 2012 | 14 | |
| 9 | 2008 | 12 | |
| 10 | 2007 | 10 | |
| 11 | 1995 | 9 | |
| 12 | 2012 | 9 | |
| 13 | 2006 | 9 | |
| 14 | 2014 | 8 | |
| 15 | Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding | 2006 | 5 |
| 16 | 2015 | 5 | |
| 17 | 2007 | 5 | |
| 18 | 2000 | 5 | |
| 19 | 2002 | 4 | |
| 20 | 2008 | 4 |
About E Perfecto
E Perfecto is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Automotive Engineering and Hardware and Architecture, having authored 49 papers that have together received 281 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (41 papers), Electronic Packaging and Soldering Technologies (38 papers), Copper Interconnects and Reliability (12 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Semiconductor materials and devices (5 papers), Advanced Welding Techniques Analysis (4 papers) and VLSI and FPGA Design Techniques (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (243 citations), Hardware and Architecture (18 citations), Polymers and Plastics (28 citations), Electronic, Optical and Magnetic Materials (35 citations) and Mechanical Engineering (63 citations). E Perfecto has collaborated with scholars based in United States, Canada and Japan. Frequent co-authors include K. Prasad, Jae-Woong Nah, Anupam Giri, Minhua Lu, G. Edward White, E. J. Cotts, Katsuyuki Sakuma, A. Deutsch, Julien Sylvestre and Babak Arfaei. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IBM Journal of Research and Development, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, IEEE Transactions on Components Hybrids and Manufacturing Technology and ECS Meeting Abstracts.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.