O. Ehrmann
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced MEMS and NEMS Technologies
- Semiconductor materials and devices
- Microwave Engineering and Waveguides
- Semiconductor Lasers and Optical Devices
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- 3D IC and TSV technologies 42
- Electronic Packaging and Soldering Technologies 34
- Advanced MEMS and NEMS Technologies 16
- Electrodeposition and Electroless Coatings 6
- CCD and CMOS Imaging Sensors 5
- Co-authors
- H. Reichl (47 shared papers)Michael J. Topper (29 shared papers)J.K. Wolf (20 shared papers)Kai Zoschke (19 shared papers)T. Fritzsch (12 shared papers)M. J. Wolf (6 shared papers)Hermann Oppermann (14 shared papers)Nils Jürgensen (4 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment (3 papers)Review of Scientific Instruments (3 papers)Journal of Instrumentation (2 papers)Applied Physics Letters (1 paper)
- Partner nations
- GermanySouth KoreaUnited States
In The Last Decade
O. Ehrmann
81 papers receiving 856 citations
Peers
Comparison fields: 5 of 59
- Electrical and Electronic Engineering 806
- Automotive Engineering 76
- Biomedical Engineering 249
- Nuclear and High Energy Physics 43
- Mechanical Engineering 100
Countries citing papers authored by O. Ehrmann
This map shows the geographic impact of O. Ehrmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by O. Ehrmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites O. Ehrmann more than expected).
Fields of papers citing papers by O. Ehrmann
This network shows the impact of papers produced by O. Ehrmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by O. Ehrmann. The network helps show where O. Ehrmann may publish in the future.
Co-authors
The 25 scholars most cited alongside O. Ehrmann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 83 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 90 | |
| 2 | 2011 | 52 | |
| 3 | 1992 | 46 | |
| 4 | 2007 | 44 | |
| 5 | 2004 | 33 | |
| 6 | 2012 | 32 | |
| 7 | 2000 | 30 | |
| 8 | 2010 | 28 | |
| 9 | 2000 | 24 | |
| 10 | 2005 | 21 | |
| 11 | 2006 | 21 | |
| 12 | 2015 | 20 | |
| 13 | MCM-D with Embedded Active and Passive Components | 1996 | 19 |
| 14 | 2009 | 18 | |
| 15 | 2002 | 18 | |
| 16 | 2007 | 17 | |
| 17 | 2010 | 17 | |
| 18 | 2003 | 17 | |
| 19 | 2002 | 16 | |
| 20 | 2000 | 15 |
About O. Ehrmann
O. Ehrmann is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Nuclear and High Energy Physics and Atomic and Molecular Physics, and Optics, having authored 83 papers that have together received 911 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (42 papers), Electronic Packaging and Soldering Technologies (34 papers), Advanced MEMS and NEMS Technologies (16 papers), Particle Detector Development and Performance (9 papers), Electrodeposition and Electroless Coatings (6 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), CCD and CMOS Imaging Sensors (5 papers) and Synthesis and properties of polymers (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (806 citations), Automotive Engineering (76 citations), Biomedical Engineering (249 citations), Nuclear and High Energy Physics (43 citations) and Mechanical Engineering (100 citations). O. Ehrmann has collaborated with scholars based in Germany, South Korea and United States. Frequent co-authors include H. Reichl, Michael J. Topper, J.K. Wolf, Kai Zoschke, T. Fritzsch, M. J. Wolf, Hermann Oppermann, Nils Jürgensen, Klaus‐Dieter Lang and Ha-Duong Ngo. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment, Review of Scientific Instruments, Journal of Instrumentation and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.