O. Ehrmann
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced MEMS and NEMS Technologies
- Semiconductor materials and devices
- Semiconductor Lasers and Optical Devices
- Microwave Engineering and Waveguides
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- 3D IC and TSV technologies 44
- Electronic Packaging and Soldering Technologies 35
- Advanced MEMS and NEMS Technologies 18
- Electrodeposition and Electroless Coatings 6
- Semiconductor Lasers and Optical Devices 5
- Co-authors
- H. Reichl (49 shared papers)Michael J. Topper (29 shared papers)J.K. Wolf (20 shared papers)Kai Zoschke (19 shared papers)T. Fritzsch (12 shared papers)M. J. Wolf (6 shared papers)Hermann Oppermann (14 shared papers)Nils Jürgensen (4 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)Review of Scientific Instruments (3 papers)Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment (3 papers)Journal of Instrumentation (2 papers)Applied Physics Letters (1 paper)
- Partner nations
- GermanyUnited StatesSouth Korea
In The Last Decade
O. Ehrmann
84 papers receiving 954 citations
Peers
Comparison fields: 5 of 61
- Electrical and Electronic Engineering 892
- Automotive Engineering 82
- Biomedical Engineering 278
- Nuclear and High Energy Physics 45
- Mechanics of Materials 76
Countries citing papers authored by O. Ehrmann
This map shows the geographic impact of O. Ehrmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by O. Ehrmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites O. Ehrmann more than expected).
Fields of papers citing papers by O. Ehrmann
This network shows the impact of papers produced by O. Ehrmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by O. Ehrmann. The network helps show where O. Ehrmann may publish in the future.
Co-authors
The 25 scholars most cited alongside O. Ehrmann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 87 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 93 | |
| 2 | 2011 | 55 | |
| 3 | 1992 | 48 | |
| 4 | 2007 | 45 | |
| 5 | 2004 | 36 | |
| 6 | 2000 | 36 | |
| 7 | 2012 | 33 | |
| 8 | 2010 | 29 | |
| 9 | 2000 | 24 | |
| 10 | 2005 | 24 | |
| 11 | 2006 | 23 | |
| 12 | 2015 | 20 | |
| 13 | 1990 | 20 | |
| 14 | 2002 | 19 | |
| 15 | MCM-D with Embedded Active and Passive Components | 1996 | 19 |
| 16 | 2007 | 18 | |
| 17 | 2009 | 18 | |
| 18 | 2003 | 18 | |
| 19 | 2010 | 18 | |
| 20 | 2000 | 16 |
About O. Ehrmann
O. Ehrmann is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Atomic and Molecular Physics, and Optics and Nuclear and High Energy Physics, having authored 87 papers that have together received 1.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (44 papers), Electronic Packaging and Soldering Technologies (35 papers), Advanced MEMS and NEMS Technologies (18 papers), Particle Detector Development and Performance (9 papers), Electrodeposition and Electroless Coatings (6 papers), Synthesis and properties of polymers (5 papers), Semiconductor Lasers and Optical Devices (5 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (892 citations), Automotive Engineering (82 citations), Biomedical Engineering (278 citations), Nuclear and High Energy Physics (45 citations) and Mechanics of Materials (76 citations). O. Ehrmann has collaborated with scholars based in Germany, United States and South Korea. Frequent co-authors include H. Reichl, Michael J. Topper, J.K. Wolf, Kai Zoschke, T. Fritzsch, M. J. Wolf, Hermann Oppermann, Nils Jürgensen, Klaus‐Dieter Lang and Ha-Duong Ngo. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Review of Scientific Instruments, Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment, Journal of Instrumentation and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.