Klaus‐Dieter Lang

94 papers and 705 indexed citations i.

Klaus‐Dieter Lang has authored 94 papers that have received a total of 705 indexed citations. This includes 77 papers in Electrical and Electronic Engineering, 17 papers in Biomedical Engineering and 13 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (30 papers) and Electromagnetic Compatibility and Noise Suppression (17 papers). Klaus‐Dieter Lang is often cited by papers focused on 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (30 papers) and Electromagnetic Compatibility and Noise Suppression (17 papers) and collaborates with scholars based in Germany, United States and United Kingdom. Klaus‐Dieter Lang's co-authors include Ivan Ndip, Ha-Duong Ngo, Martin Schneider‐Ramelow, H. Reichl and Heino Henke and has published in prestigious journals such as Sensors, Resources Conservation and Recycling and IEEE Transactions on Electron Devices.