W.C. Chiou
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor Lasers and Optical Devices
- Hardware and Architecture top 10%
Papers in
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- 3D IC and TSV technologies 15
- Electronic Packaging and Soldering Technologies 9
- Semiconductor materials and devices 9
- Advancements in Photolithography Techniques 4
- Advancements in Semiconductor Devices and Circuit Design 2
- Integrated Circuits and Semiconductor Failure Analysis 2
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- Copper Interconnects and Reliability 6
- Co-authors
- Douglas Yu (8 shared papers)C. T. Wang (4 shared papers)K. C. Ting (4 shared papers)S. Y. Hou (4 shared papers)Christine Chiu (2 shared papers)Cheng‐Hsien Wu (3 shared papers)Doug C. H. Yu (3 shared papers)Chung-Hao Tsai (3 shared papers)
- Journals
- IEEE Transactions on Electron Devices (2 papers)Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)Symposium on VLSI Technology (1 paper)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
W.C. Chiou
22 papers receiving 543 citations
Peers
Comparison fields: 5 of 37
- Electrical and Electronic Engineering 531
- Hardware and Architecture 65
- Automotive Engineering 57
- Electronic, Optical and Magnetic Materials 61
- Biomedical Engineering 81
Countries citing papers authored by W.C. Chiou
This map shows the geographic impact of W.C. Chiou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W.C. Chiou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W.C. Chiou more than expected).
Fields of papers citing papers by W.C. Chiou
This network shows the impact of papers produced by W.C. Chiou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W.C. Chiou. The network helps show where W.C. Chiou may publish in the future.
Co-authors
The 25 scholars most cited alongside W.C. Chiou, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 168 | |
| 2 | 2021 | 64 | |
| 3 | 2020 | 56 | |
| 4 | 2019 | 55 | |
| 5 | 2020 | 43 | |
| 6 | 2019 | 38 | |
| 7 | 2009 | 36 | |
| 8 | 2020 | 35 | |
| 9 | TSV process optimization for reduced device impact on 28nm CMOS | 2011 | 25 |
| 10 | 2021 | 23 | |
| 11 | 2011 | 10 | |
| 12 | 2020 | 8 | |
| 13 | 2014 | 7 | |
| 14 | 2003 | 4 | |
| 15 | 2004 | 3 | |
| 16 | 2002 | 3 | |
| 17 | 2008 | 2 | |
| 18 | 2004 | 2 | |
| 19 | An integrated air gap structure to achieve high-performance TSV interconnects for 28nm 3D-IC integration | 2013 | 2 |
| 20 | 2008 | 2 |
About W.C. Chiou
W.C. Chiou is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Hardware and Architecture, Automotive Engineering and Information Systems, having authored 23 papers that have together received 588 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (9 papers), Semiconductor materials and devices (9 papers), Copper Interconnects and Reliability (6 papers), Advancements in Photolithography Techniques (4 papers), VLSI and Analog Circuit Testing (2 papers), Advancements in Semiconductor Devices and Circuit Design (2 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (531 citations), Hardware and Architecture (65 citations), Automotive Engineering (57 citations), Electronic, Optical and Magnetic Materials (61 citations) and Biomedical Engineering (81 citations). W.C. Chiou has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Douglas Yu, C. T. Wang, K. C. Ting, S. Y. Hou, Christine Chiu, Cheng‐Hsien Wu, Doug C. H. Yu, Chung-Hao Tsai, Chung-Hsien Tsai and Chi‐Hua Tung. Their work appears in journals such as IEEE Transactions on Electron Devices, Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE and Symposium on VLSI Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.