C. Chappaz
Impact in
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- Copper Interconnects and Reliability
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Copper Interconnects and Reliability 10
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- Electronic Packaging and Soldering Technologies 10
- 3D IC and TSV technologies 9
- Semiconductor materials and devices 3
- Co-authors
- Stephane Moreau (4 shared papers)Lorena Anghel (4 shared papers)Thomas Frank (4 shared papers)Louise Lallement Arnaud (4 shared papers)Philip R. LeDuc (2 shared papers)Aurélie Thuaire (2 shared papers)F. Lorut (2 shared papers)Emmanuel Chery (2 shared papers)
- Journals
- Microelectronics Reliability (1 paper)IEEE Journal of Solid-State Circuits (1 paper)Journal of Micromechanics and Microengineering (1 paper)Mechatronics (1 paper)Journal of The Electrochemical Society (1 paper)
- Partner nations
- FranceSwitzerlandIndia
In The Last Decade
C. Chappaz
20 papers receiving 365 citations
Peers
Comparison fields: 5 of 28
- Electronic, Optical and Magnetic Materials 108
- Electrical and Electronic Engineering 317
- Automotive Engineering 45
- Biomedical Engineering 81
- Cognitive Neuroscience 34
Countries citing papers authored by C. Chappaz
This map shows the geographic impact of C. Chappaz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Chappaz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Chappaz more than expected).
Fields of papers citing papers by C. Chappaz
This network shows the impact of papers produced by C. Chappaz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Chappaz. The network helps show where C. Chappaz may publish in the future.
Co-authors
The 25 scholars most cited alongside C. Chappaz, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 21 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 104 | |
| 2 | 2011 | 78 | |
| 3 | 2011 | 68 | |
| 4 | 2011 | 26 | |
| 5 | 2013 | 21 | |
| 6 | 2009 | 14 | |
| 7 | 2016 | 12 | |
| 8 | 2010 | 11 | |
| 9 | 2014 | 6 | |
| 10 | 2016 | 6 | |
| 11 | 2012 | 5 | |
| 12 | 2008 | 5 | |
| 13 | 2014 | 4 | |
| 14 | 2007 | 4 | |
| 15 | Modeling of Electromigration Induced Failure Mechanism in Semiconductor Devices | 2007 | 4 |
| 16 | 2015 | 3 | |
| 17 | 2015 | 2 | |
| 18 | 2012 | 2 | |
| 19 | 2010 | 1 | |
| 20 | 2012 | 1 |
About C. Chappaz
C. Chappaz is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Biomedical Engineering, Cognitive Neuroscience and Ocean Engineering, having authored 21 papers that have together received 377 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (10 papers), Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (9 papers), Tactile and Sensory Interactions (4 papers), Acoustic Wave Resonator Technologies (3 papers), Advanced Sensor and Energy Harvesting Materials (3 papers), Semiconductor materials and devices (3 papers) and Geophysics and Sensor Technology (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (108 citations), Electrical and Electronic Engineering (317 citations), Automotive Engineering (45 citations), Biomedical Engineering (81 citations) and Cognitive Neuroscience (34 citations). C. Chappaz has collaborated with scholars based in France, Switzerland and India. Frequent co-authors include Stephane Moreau, Lorena Anghel, Thomas Frank, Louise Lallement Arnaud, Philip R. LeDuc, Aurélie Thuaire, F. Lorut, Emmanuel Chery, L. Di Cioccio and R. Taïbi. Their work appears in journals such as Microelectronics Reliability, IEEE Journal of Solid-State Circuits, Journal of Micromechanics and Microengineering, Mechatronics and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.