David Ho
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor Lasers and Optical Devices
- Photonic and Optical Devices
- Hardware and Architecture top 10%
Papers in
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- 3D IC and TSV technologies 33
- Electronic Packaging and Soldering Technologies 26
- Electromagnetic Compatibility and Noise Suppression 6
- Semiconductor Lasers and Optical Devices 5
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- VLSI and Analog Circuit Testing 5
- Co-authors
- Fa Xing (7 shared papers)Xiaowu Zhang (6 shared papers)Chong Ser Choong (6 shared papers)Chai Tai Chong (6 shared papers)Batara Surya (10 shared papers)Vempati Srinivasa Rao (4 shared papers)Teck Guan Lim (7 shared papers)Songbai Zhang (1 shared paper)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Materials (1 paper)Applied Physics Reviews (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2 papers)IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society (1 paper)
- Partner nations
- SingaporeTaiwanUnited States
In The Last Decade
David Ho
47 papers receiving 597 citations
Peers
Comparison fields: 5 of 37
- Electrical and Electronic Engineering 583
- Hardware and Architecture 36
- Electronic, Optical and Magnetic Materials 94
- Automotive Engineering 32
- Biomedical Engineering 113
Countries citing papers authored by David Ho
This map shows the geographic impact of David Ho's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Ho with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Ho more than expected).
Fields of papers citing papers by David Ho
This network shows the impact of papers produced by David Ho. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Ho. The network helps show where David Ho may publish in the future.
Co-authors
The 25 scholars most cited alongside David Ho, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 47 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 108 | |
| 2 | 2016 | 99 | |
| 3 | 2015 | 77 | |
| 4 | 2016 | 63 | |
| 5 | 2018 | 30 | |
| 6 | 2017 | 24 | |
| 7 | 2011 | 23 | |
| 8 | 2011 | 15 | |
| 9 | 2018 | 15 | |
| 10 | 2019 | 12 | |
| 11 | 2023 | 12 | |
| 12 | 2021 | 11 | |
| 13 | 2022 | 11 | |
| 14 | 2021 | 9 | |
| 15 | 2012 | 9 | |
| 16 | 2017 | 9 | |
| 17 | 2021 | 9 | |
| 18 | 2018 | 8 | |
| 19 | 2020 | 6 | |
| 20 | 2015 | 6 |
About David Ho
David Ho is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Automotive Engineering, Aerospace Engineering and Electronic, Optical and Magnetic Materials, having authored 47 papers that have together received 632 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (33 papers), Electronic Packaging and Soldering Technologies (26 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), VLSI and Analog Circuit Testing (5 papers), Semiconductor Lasers and Optical Devices (5 papers), Copper Interconnects and Reliability (4 papers), Manufacturing Process and Optimization (4 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (583 citations), Hardware and Architecture (36 citations), Electronic, Optical and Magnetic Materials (94 citations), Automotive Engineering (32 citations) and Biomedical Engineering (113 citations). David Ho has collaborated with scholars based in Singapore, Taiwan and United States. Frequent co-authors include Fa Xing, Xiaowu Zhang, Chong Ser Choong, Chai Tai Chong, Batara Surya, Vempati Srinivasa Rao, Teck Guan Lim, Songbai Zhang, Hong Yu Li and Liang Ding. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Materials, Applied Physics Reviews, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) and IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.