Michael Toepper
Impact in
-
- Neuroscience and Neural Engineering
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced Memory and Neural Computing
- Wireless Power Transfer Systems
Papers in
-
- 3D IC and TSV technologies 18
- Electronic Packaging and Soldering Technologies 14
- Semiconductor materials and devices 6
- Semiconductor Lasers and Optical Devices 5
- Thin-Film Transistor Technologies 3
-
- Neuroscience and Neural Engineering 5
- Co-authors
- Matthias Klein (8 shared papers)Florian Solzbacher (6 shared papers)Sohee Kim (6 shared papers)Hermann H. Oppermann (5 shared papers)Prashant Tathireddy (3 shared papers)Sandeep Negi (2 shared papers)Loren W. Rieth (2 shared papers)Rajmohan Bhandari (2 shared papers)
- Journals
- Biomedical Microdevices (1 paper)Sensors and Actuators A Physical (1 paper)Journal of Physics Conference Series (1 paper)SPIE eBooks (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)
- Partner nations
- GermanyUnited StatesFrance
In The Last Decade
Michael Toepper
34 papers receiving 358 citations
Peers
Comparison fields: 5 of 40
- Cellular and Molecular Neuroscience 148
- Electrical and Electronic Engineering 279
- Cognitive Neuroscience 90
- Biomedical Engineering 120
- Polymers and Plastics 37
Countries citing papers authored by Michael Toepper
This map shows the geographic impact of Michael Toepper's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Toepper with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Toepper more than expected).
Fields of papers citing papers by Michael Toepper
This network shows the impact of papers produced by Michael Toepper. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Toepper. The network helps show where Michael Toepper may publish in the future.
Co-authors
The 25 scholars most cited alongside Michael Toepper, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 130 | |
| 2 | 2006 | 26 | |
| 3 | 2012 | 18 | |
| 4 | 2007 | 18 | |
| 5 | 2006 | 18 | |
| 6 | 2018 | 17 | |
| 7 | Chip Size Package - The Option of Choice for Miniaturized Medical Devices | 1998 | 15 |
| 8 | 2017 | 11 | |
| 9 | 2007 | 11 | |
| 10 | 2013 | 10 | |
| 11 | 2006 | 9 | |
| 12 | 2010 | 8 | |
| 13 | 2013 | 7 | |
| 14 | 2007 | 7 | |
| 15 | 2011 | 6 | |
| 16 | 2014 | 6 | |
| 17 | A critical review of corrosion phenomena in microelectronic systems | 2014 | 6 |
| 18 | 2018 | 6 | |
| 19 | 2009 | 5 | |
| 20 | 2011 | 5 |
About Michael Toepper
Michael Toepper is a scholar working on Electrical and Electronic Engineering, Cellular and Molecular Neuroscience, Electronic, Optical and Magnetic Materials, Polymers and Plastics and Hardware and Architecture, having authored 34 papers that have together received 376 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (14 papers), Semiconductor materials and devices (6 papers), Neuroscience and Neural Engineering (5 papers), Copper Interconnects and Reliability (5 papers), Semiconductor Lasers and Optical Devices (5 papers), Synthesis and properties of polymers (3 papers) and Thin-Film Transistor Technologies (3 papers). The work is most often cited by research in Cellular and Molecular Neuroscience (148 citations), Electrical and Electronic Engineering (279 citations), Cognitive Neuroscience (90 citations), Biomedical Engineering (120 citations) and Polymers and Plastics (37 citations). Michael Toepper has collaborated with scholars based in Germany, United States and France. Frequent co-authors include Matthias Klein, Florian Solzbacher, Sohee Kim, Hermann H. Oppermann, Prashant Tathireddy, Sandeep Negi, Loren W. Rieth, Rajmohan Bhandari, Kai Zoschke and H. Reichl. Their work appears in journals such as Biomedical Microdevices, Sensors and Actuators A Physical, Journal of Physics Conference Series, SPIE eBooks and Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.