H. Walter
Impact in
- Condensed Matter Physics top 5%
- Physics of Superconductivity and Magnetism
- Superconductivity in MgB2 and Alloys
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- HVDC Systems and Fault Protection
Papers in
-
- Electronic Packaging and Soldering Technologies 54
- 3D IC and TSV technologies 27
- HVDC Systems and Fault Protection 7
-
- Mechanical Behavior of Composites 19
- Co-authors
- B. Michel (27 shared papers)J. Böck (10 shared papers)R. Dudek (13 shared papers)A. Leenders (12 shared papers)H.C. Freyhardt (13 shared papers)Andreas Schubert (4 shared papers)Bernhard Wunderle (24 shared papers)F. Breuer (7 shared papers)
- Journals
- Physica C Superconductivity (7 papers)IEEE Transactions on Applied Superconductivity (6 papers)Superconductor Science and Technology (5 papers)Microelectronics Reliability (4 papers)Microsystem Technologies (2 papers)
- Partner nations
- GermanyUnited KingdomAustria
In The Last Decade
H. Walter
107 papers receiving 1.5k citations
Peers
Comparison fields: 5 of 68
- Condensed Matter Physics 447
- Electrical and Electronic Engineering 1.0k
- Mechanics of Materials 277
- Mechanical Engineering 408
- Electronic, Optical and Magnetic Materials 178
Countries citing papers authored by H. Walter
This map shows the geographic impact of H. Walter's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Walter with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Walter more than expected).
Fields of papers citing papers by H. Walter
This network shows the impact of papers produced by H. Walter. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Walter. The network helps show where H. Walter may publish in the future.
Co-authors
The 25 scholars most cited alongside H. Walter, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 112 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 120 | |
| 2 | 2005 | 90 | |
| 3 | 1998 | 87 | |
| 4 | 2001 | 67 | |
| 5 | 2002 | 64 | |
| 6 | 2003 | 57 | |
| 7 | 2008 | 46 | |
| 8 | 2012 | 43 | |
| 9 | 2009 | 37 | |
| 10 | 2004 | 36 | |
| 11 | 1999 | 36 | |
| 12 | 2000 | 36 | |
| 13 | 2004 | 34 | |
| 14 | 2004 | 32 | |
| 15 | 2016 | 31 | |
| 16 | 2004 | 29 | |
| 17 | 2006 | 29 | |
| 18 | 2014 | 29 | |
| 19 | 2010 | 28 | |
| 20 | 2017 | 28 |
About H. Walter
H. Walter is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Biomedical Engineering and Condensed Matter Physics, having authored 112 papers that have together received 1.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (54 papers), 3D IC and TSV technologies (27 papers), Mechanical Behavior of Composites (19 papers), Physics of Superconductivity and Magnetism (19 papers), Epoxy Resin Curing Processes (12 papers), Superconducting Materials and Applications (11 papers), Advanced Sensor and Energy Harvesting Materials (8 papers) and HVDC Systems and Fault Protection (7 papers). The work is most often cited by research in Condensed Matter Physics (447 citations), Electrical and Electronic Engineering (1.0k citations), Mechanics of Materials (277 citations), Mechanical Engineering (408 citations) and Electronic, Optical and Magnetic Materials (178 citations). H. Walter has collaborated with scholars based in Germany, United Kingdom and Austria. Frequent co-authors include B. Michel, J. Böck, R. Dudek, A. Leenders, H.C. Freyhardt, Andreas Schubert, Bernhard Wunderle, F. Breuer, S. Elschner and Torsten Linz. Their work appears in journals such as Physica C Superconductivity, IEEE Transactions on Applied Superconductivity, Superconductor Science and Technology, Microelectronics Reliability and Microsystem Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.