D. May
Impact in
- Mechanics of Materials top 10%
- Thermography and Photoacoustic Techniques
- Ultrasonics and Acoustic Wave Propagation
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- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Thermography and Photoacoustic Techniques 23
- Ultrasonics and Acoustic Wave Propagation 9
- Adhesion, Friction, and Surface Interactions 6
-
- Electronic Packaging and Soldering Technologies 21
- Integrated Circuits and Semiconductor Failure Analysis 8
- Silicon Carbide Semiconductor Technologies 6
- Co-authors
- Bernhard Wunderle (49 shared papers)Mohamad Abo Ras (31 shared papers)B. Michel (19 shared papers)A. Vecht (2 shared papers)H. Krauth (1 shared paper)Hermann Oppermann (11 shared papers)Jens Heilmann (9 shared papers)J. Bauer (5 shared papers)
- Journals
- IEEE Transactions on Magnetics (2 papers)Microelectronics Reliability (2 papers)Physica C Superconductivity (1 paper)IEEE Transactions on Applied Superconductivity (1 paper)Thin Solid Films (1 paper)
- Partner nations
- GermanyFranceUnited Kingdom
In The Last Decade
D. May
53 papers receiving 303 citations
Peers
Comparison fields: 5 of 41
- Mechanics of Materials 135
- Electrical and Electronic Engineering 175
- Materials Chemistry 94
- Mechanical Engineering 76
- Condensed Matter Physics 18
Countries citing papers authored by D. May
This map shows the geographic impact of D. May's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. May with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. May more than expected).
Fields of papers citing papers by D. May
This network shows the impact of papers produced by D. May. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. May. The network helps show where D. May may publish in the future.
Co-authors
The 25 scholars most cited alongside D. May, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 59 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1975 | 18 | |
| 2 | 1981 | 14 | |
| 3 | 2010 | 13 | |
| 4 | 2006 | 12 | |
| 5 | 2012 | 11 | |
| 6 | 2015 | 11 | |
| 7 | 2019 | 10 | |
| 8 | 2013 | 10 | |
| 9 | Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials | 2010 | 10 |
| 10 | 2008 | 10 | |
| 11 | 2012 | 10 | |
| 12 | 2011 | 10 | |
| 13 | 2018 | 9 | |
| 14 | 2016 | 9 | |
| 15 | 2016 | 9 | |
| 16 | 2023 | 8 | |
| 17 | 1993 | 8 | |
| 18 | 2013 | 8 | |
| 19 | 2008 | 8 | |
| 20 | 2015 | 7 |
About D. May
D. May is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering and Aerospace Engineering, having authored 59 papers that have together received 318 indexed citations. Recurring topics across this work include Thermography and Photoacoustic Techniques (23 papers), Electronic Packaging and Soldering Technologies (21 papers), Thermal properties of materials (11 papers), Ultrasonics and Acoustic Wave Propagation (9 papers), Integrated Circuits and Semiconductor Failure Analysis (8 papers), Heat Transfer and Optimization (7 papers), Adhesion, Friction, and Surface Interactions (6 papers) and Silicon Carbide Semiconductor Technologies (6 papers). The work is most often cited by research in Mechanics of Materials (135 citations), Electrical and Electronic Engineering (175 citations), Materials Chemistry (94 citations), Mechanical Engineering (76 citations) and Condensed Matter Physics (18 citations). D. May has collaborated with scholars based in Germany, France and United Kingdom. Frequent co-authors include Bernhard Wunderle, Mohamad Abo Ras, B. Michel, A. Vecht, H. Krauth, Hermann Oppermann, Jens Heilmann, J. Bauer, H. Reichl and Thomas Winkler. Their work appears in journals such as IEEE Transactions on Magnetics, Microelectronics Reliability, Physica C Superconductivity, IEEE Transactions on Applied Superconductivity and Thin Solid Films.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.