Ivan Ndip
Impact in
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- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Advanced MEMS and NEMS Technologies
- Microwave and Dielectric Measurement Techniques
- Photonic and Optical Devices
- Aerospace Engineering top 5%
- Antenna Design and Analysis
Papers in
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- Microwave Engineering and Waveguides 44
- 3D IC and TSV technologies 44
- Electromagnetic Compatibility and Noise Suppression 34
- Electronic Packaging and Soldering Technologies 19
- Microwave and Dielectric Measurement Techniques 8
- Radio Frequency Integrated Circuit Design 4
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- Antenna Design and Analysis 43
- Radar Systems and Signal Processing 4
- Co-authors
- H. Reichl (52 shared papers)Klaus‐Dieter Lang (64 shared papers)Stephan Guttowski (39 shared papers)Heino Henke (9 shared papers)Michael J. Topper (7 shared papers)Lars Brusberg (5 shared papers)Christian Bernd Tschoban (29 shared papers)Nils F. Nissen (4 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (8 papers)IEEE Transactions on Electromagnetic Compatibility (4 papers)IEEE Transactions on Antennas and Propagation (2 papers)IEEE Transactions on Microwave Theory and Techniques (2 papers)Electronics Letters (1 paper)
- Partner nations
- GermanyUnited StatesJapan
In The Last Decade
Ivan Ndip
136 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 36
- Electrical and Electronic Engineering 973
- Aerospace Engineering 239
- Hardware and Architecture 18
- Ceramics and Composites 13
- Media Technology 13
Countries citing papers authored by Ivan Ndip
This map shows the geographic impact of Ivan Ndip's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ivan Ndip with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ivan Ndip more than expected).
Fields of papers citing papers by Ivan Ndip
This network shows the impact of papers produced by Ivan Ndip. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ivan Ndip. The network helps show where Ivan Ndip may publish in the future.
Co-authors
The 25 scholars most cited alongside Ivan Ndip, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 149 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 124 | |
| 2 | 2010 | 122 | |
| 3 | 2013 | 70 | |
| 4 | 2015 | 50 | |
| 5 | 2014 | 34 | |
| 6 | 2010 | 32 | |
| 7 | 2010 | 28 | |
| 8 | 2010 | 28 | |
| 9 | 2012 | 27 | |
| 10 | Modeling and quantification of conventional and coax-TSVs for RF applications | 2009 | 25 |
| 11 | 2016 | 23 | |
| 12 | 2018 | 23 | |
| 13 | 2010 | 21 | |
| 14 | 2009 | 17 | |
| 15 | 2014 | 17 | |
| 16 | 2018 | 17 | |
| 17 | 2016 | 16 | |
| 18 | 2013 | 15 | |
| 19 | 2020 | 15 | |
| 20 | 2021 | 14 |
About Ivan Ndip
Ivan Ndip is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Media Technology, Biomedical Engineering and Hardware and Architecture, having authored 149 papers that have together received 1.2k indexed citations. Recurring topics across this work include Microwave Engineering and Waveguides (44 papers), 3D IC and TSV technologies (44 papers), Antenna Design and Analysis (43 papers), Electromagnetic Compatibility and Noise Suppression (34 papers), Electronic Packaging and Soldering Technologies (19 papers), Microwave and Dielectric Measurement Techniques (8 papers), Radar Systems and Signal Processing (4 papers) and Radio Frequency Integrated Circuit Design (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (973 citations), Aerospace Engineering (239 citations), Hardware and Architecture (18 citations), Ceramics and Composites (13 citations) and Media Technology (13 citations). Ivan Ndip has collaborated with scholars based in Germany, United States and Japan. Frequent co-authors include H. Reichl, Klaus‐Dieter Lang, Stephan Guttowski, Heino Henke, Michael J. Topper, Lars Brusberg, Christian Bernd Tschoban, Nils F. Nissen, H. Schröder and Hidefumi Yamamoto. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Antennas and Propagation, IEEE Transactions on Microwave Theory and Techniques and Electronics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.