Ivan Ndip
Impact in
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- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Microwave Engineering and Waveguides
- Semiconductor Lasers and Optical Devices
- Millimeter-Wave Propagation and Modeling
- Aerospace Engineering top 5%
- Antenna Design and Analysis
- Advanced Antenna and Metasurface Technologies
Papers in
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- Electromagnetic Compatibility and Noise Suppression 67
- Microwave Engineering and Waveguides 58
- 3D IC and TSV technologies 58
- Electronic Packaging and Soldering Technologies 34
- Millimeter-Wave Propagation and Modeling 14
- Microwave and Dielectric Measurement Techniques 10
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- Antenna Design and Analysis 33
- Advanced Antenna and Metasurface Technologies 27
- Co-authors
- H. Reichl (52 shared papers)Klaus‐Dieter Lang (60 shared papers)Stephan Guttowski (35 shared papers)Heino Henke (9 shared papers)Brian Curran (18 shared papers)Michael J. Topper (7 shared papers)Christian Tschoban (28 shared papers)Lars Brusberg (4 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (8 papers)IEEE Transactions on Electromagnetic Compatibility (5 papers)IEEE Transactions on Microwave Theory and Techniques (2 papers)IEEE Transactions on Antennas and Propagation (2 papers)Electronics Letters (1 paper)
- Partner nations
- GermanyUnited StatesUnited Kingdom
In The Last Decade
Ivan Ndip
132 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 44
- Electrical and Electronic Engineering 1.1k
- Aerospace Engineering 298
- Biomedical Engineering 161
- Automotive Engineering 43
- Media Technology 30
Countries citing papers authored by Ivan Ndip
This map shows the geographic impact of Ivan Ndip's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ivan Ndip with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ivan Ndip more than expected).
Fields of papers citing papers by Ivan Ndip
This network shows the impact of papers produced by Ivan Ndip. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ivan Ndip. The network helps show where Ivan Ndip may publish in the future.
Co-authors
The 25 scholars most cited alongside Ivan Ndip, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 145 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 120 | |
| 2 | 2010 | 115 | |
| 3 | 2013 | 66 | |
| 4 | 2015 | 50 | |
| 5 | 2010 | 32 | |
| 6 | 2014 | 31 | |
| 7 | 2010 | 28 | |
| 8 | 2010 | 27 | |
| 9 | Modeling and quantification of conventional and coax-TSVs for RF applications | 2009 | 25 |
| 10 | 2012 | 25 | |
| 11 | 2018 | 23 | |
| 12 | 2016 | 23 | |
| 13 | 2010 | 21 | |
| 14 | 2009 | 16 | |
| 15 | 2018 | 16 | |
| 16 | 2013 | 15 | |
| 17 | 2014 | 15 | |
| 18 | 2016 | 15 | |
| 19 | 2020 | 13 | |
| 20 | 2010 | 12 |
About Ivan Ndip
Ivan Ndip is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials and Media Technology, having authored 145 papers that have together received 1.2k indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (67 papers), Microwave Engineering and Waveguides (58 papers), 3D IC and TSV technologies (58 papers), Electronic Packaging and Soldering Technologies (34 papers), Antenna Design and Analysis (33 papers), Advanced Antenna and Metasurface Technologies (27 papers), Millimeter-Wave Propagation and Modeling (14 papers) and Microwave and Dielectric Measurement Techniques (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.1k citations), Aerospace Engineering (298 citations), Biomedical Engineering (161 citations), Automotive Engineering (43 citations) and Media Technology (30 citations). Ivan Ndip has collaborated with scholars based in Germany, United States and United Kingdom. Frequent co-authors include H. Reichl, Klaus‐Dieter Lang, Stephan Guttowski, Heino Henke, Brian Curran, Michael J. Topper, Christian Tschoban, Lars Brusberg, Nils F. Nissen and H. Schröder. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Antennas and Propagation and Electronics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.