Kai Zoschke
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced MEMS and NEMS Technologies
- Semiconductor materials and devices
- Radio Frequency Integrated Circuit Design
- Microwave Engineering and Waveguides
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 45
- Electronic Packaging and Soldering Technologies 27
- Advanced MEMS and NEMS Technologies 18
- Semiconductor Lasers and Optical Devices 6
- CCD and CMOS Imaging Sensors 5
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- Acoustic Wave Resonator Technologies 5
- Nanofabrication and Lithography Techniques 5
- Co-authors
- H. Reichl (14 shared papers)O. Ehrmann (19 shared papers)Hermann Oppermann (27 shared papers)T. Fritzsch (10 shared papers)M. J. Wolf (7 shared papers)Klaus‐Dieter Lang (15 shared papers)Michael J. Topper (7 shared papers)Martin Wilke (10 shared papers)
- Journals
- Journal of Instrumentation (4 papers)IEEE Transactions on Advanced Packaging (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Journal of Solid-State Circuits (1 paper)Sensors and Actuators A Physical (1 paper)
- Partner nations
- GermanyFinlandSwitzerland
In The Last Decade
Kai Zoschke
64 papers receiving 604 citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 586
- Automotive Engineering 53
- Biomedical Engineering 167
- Nuclear and High Energy Physics 38
- Cellular and Molecular Neuroscience 26
Countries citing papers authored by Kai Zoschke
This map shows the geographic impact of Kai Zoschke's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kai Zoschke with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kai Zoschke more than expected).
Fields of papers citing papers by Kai Zoschke
This network shows the impact of papers produced by Kai Zoschke. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kai Zoschke. The network helps show where Kai Zoschke may publish in the future.
Co-authors
The 25 scholars most cited alongside Kai Zoschke, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 64 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 64 | |
| 2 | 2011 | 52 | |
| 3 | 2007 | 44 | |
| 4 | 2004 | 33 | |
| 5 | 2012 | 32 | |
| 6 | 2010 | 28 | |
| 7 | 2006 | 26 | |
| 8 | 2013 | 22 | |
| 9 | 2009 | 18 | |
| 10 | 2007 | 17 | |
| 11 | 2010 | 17 | |
| 12 | 2009 | 16 | |
| 13 | 2015 | 15 | |
| 14 | 2013 | 14 | |
| 15 | 2016 | 12 | |
| 16 | 2012 | 12 | |
| 17 | 2005 | 11 | |
| 18 | 2012 | 10 | |
| 19 | 2014 | 9 | |
| 20 | 2016 | 9 |
About Kai Zoschke
Kai Zoschke is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Nuclear and High Energy Physics, Automotive Engineering and Polymers and Plastics, having authored 64 papers that have together received 624 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (45 papers), Electronic Packaging and Soldering Technologies (27 papers), Advanced MEMS and NEMS Technologies (18 papers), Particle Detector Development and Performance (7 papers), Semiconductor Lasers and Optical Devices (6 papers), Acoustic Wave Resonator Technologies (5 papers), CCD and CMOS Imaging Sensors (5 papers) and Nanofabrication and Lithography Techniques (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (586 citations), Automotive Engineering (53 citations), Biomedical Engineering (167 citations), Nuclear and High Energy Physics (38 citations) and Cellular and Molecular Neuroscience (26 citations). Kai Zoschke has collaborated with scholars based in Germany, Finland and Switzerland. Frequent co-authors include H. Reichl, O. Ehrmann, Hermann Oppermann, T. Fritzsch, M. J. Wolf, Klaus‐Dieter Lang, Michael J. Topper, Martin Wilke, J.K. Wolf and Michael Toepper. Their work appears in journals such as Journal of Instrumentation, IEEE Transactions on Advanced Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Journal of Solid-State Circuits and Sensors and Actuators A Physical.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.