D. Harmon
Impact in
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- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Ferroelectric and Negative Capacitance Devices
- Electrostatic Discharge in Electronics
- Radio Frequency Integrated Circuit Design
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- Copper Interconnects and Reliability
Papers in
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- Semiconductor materials and devices 20
- Advancements in Semiconductor Devices and Circuit Design 13
- Integrated Circuits and Semiconductor Failure Analysis 13
- Electronic Packaging and Soldering Technologies 5
- 3D IC and TSV technologies 3
- Electromagnetic Compatibility and Noise Suppression 2
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- Copper Interconnects and Reliability 7
- Co-authors
- Ernest Y. Wu (10 shared papers)A. Vayshenker (8 shared papers)E. Nowak (7 shared papers)W. Lai (9 shared papers)J. Suñé (6 shared papers)J. A. McKenna (5 shared papers)R.‐P. Vollertsen (3 shared papers)S. Nguyen (1 shared paper)
- Journals
- Microelectronics Reliability (4 papers)Journal of The Electrochemical Society (2 papers)IBM Journal of Research and Development (2 papers)IEEE Transactions on Device and Materials Reliability (1 paper)IEEE Electron Device Letters (1 paper)
- Partner nations
- United StatesSpainTaiwan
In The Last Decade
D. Harmon
27 papers receiving 780 citations
Peers
Comparison fields: 5 of 45
- Electrical and Electronic Engineering 764
- Electronic, Optical and Magnetic Materials 170
- Hardware and Architecture 47
- Ceramics and Composites 19
- Materials Chemistry 144
Countries citing papers authored by D. Harmon
This map shows the geographic impact of D. Harmon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Harmon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Harmon more than expected).
Fields of papers citing papers by D. Harmon
This network shows the impact of papers produced by D. Harmon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Harmon. The network helps show where D. Harmon may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Harmon, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 116 | |
| 2 | 2002 | 93 | |
| 3 | 1990 | 80 | |
| 4 | 2009 | 73 | |
| 5 | 2002 | 69 | |
| 6 | 2002 | 62 | |
| 7 | 2008 | 41 | |
| 8 | 2000 | 34 | |
| 9 | 2001 | 31 | |
| 10 | 1989 | 26 | |
| 11 | 2003 | 25 | |
| 12 | 2004 | 22 | |
| 13 | 2003 | 21 | |
| 14 | 2002 | 21 | |
| 15 | 2004 | 19 | |
| 16 | 2001 | 15 | |
| 17 | 2006 | 14 | |
| 18 | 2006 | 13 | |
| 19 | 1982 | 11 | |
| 20 | 2005 | 8 |
About D. Harmon
D. Harmon is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Mechanics of Materials and Hardware and Architecture, having authored 27 papers that have together received 829 indexed citations. Recurring topics across this work include Semiconductor materials and devices (20 papers), Advancements in Semiconductor Devices and Circuit Design (13 papers), Integrated Circuits and Semiconductor Failure Analysis (13 papers), Copper Interconnects and Reliability (7 papers), Electronic Packaging and Soldering Technologies (5 papers), Electronic and Structural Properties of Oxides (3 papers), 3D IC and TSV technologies (3 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (764 citations), Electronic, Optical and Magnetic Materials (170 citations), Hardware and Architecture (47 citations), Ceramics and Composites (19 citations) and Materials Chemistry (144 citations). D. Harmon has collaborated with scholars based in United States, Spain and Taiwan. Frequent co-authors include Ernest Y. Wu, A. Vayshenker, E. Nowak, W. Lai, J. Suñé, J. A. McKenna, R.‐P. Vollertsen, S. Nguyen, D. Dobuzinsky and T. Sullivan. Their work appears in journals such as Microelectronics Reliability, Journal of The Electrochemical Society, IBM Journal of Research and Development, IEEE Transactions on Device and Materials Reliability and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.