Fa Xing
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Silicon Carbide Semiconductor Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 42
- 3D IC and TSV technologies 15
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- Rock Mechanics and Modeling 1
- Metal and Thin Film Mechanics 1
- Co-authors
- Irfan Anjum Badruddin Magami (9 shared papers)Mohd Faizul Mohd Sabri (9 shared papers)Dhafer Abdulameer Shnawah (8 shared papers)Suhana Mohd Said (8 shared papers)Masaya Kawano (5 shared papers)John H L Pang (5 shared papers)Xiaowu Zhang (4 shared papers)Hong Miao Ji (2 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (8 papers)IEEE Transactions on Device and Materials Reliability (4 papers)Journal of Electronic Materials (3 papers)Microelectronics Reliability (2 papers)Journal of Materials Science Materials in Electronics (1 paper)
- Partner nations
- SingaporeUnited StatesMalaysia
In The Last Decade
Fa Xing
53 papers receiving 740 citations
Peers
Comparison fields: 5 of 23
- Electrical and Electronic Engineering 753
- General Materials Science 4
- Electronic, Optical and Magnetic Materials 10
- Safety, Risk, Reliability and Quality 6
- Mechanical Engineering 21
Countries citing papers authored by Fa Xing
This map shows the geographic impact of Fa Xing's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fa Xing with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fa Xing more than expected).
Fields of papers citing papers by Fa Xing
This network shows the impact of papers produced by Fa Xing. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fa Xing. The network helps show where Fa Xing may publish in the future.
Co-authors
The 25 scholars most cited alongside Fa Xing, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 56 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 93 | |
| 2 | 2012 | 63 | |
| 3 | 2013 | 59 | |
| 4 | 2012 | 54 | |
| 5 | 2020 | 52 | |
| 6 | 2012 | 39 | |
| 7 | 2016 | 35 | |
| 8 | 2019 | 31 | |
| 9 | 2020 | 31 | |
| 10 | 2012 | 20 | |
| 11 | 2015 | 20 | |
| 12 | 2017 | 19 | |
| 13 | 2012 | 18 | |
| 14 | 2018 | 17 | |
| 15 | 2018 | 16 | |
| 16 | 2015 | 15 | |
| 17 | 2020 | 14 | |
| 18 | 2014 | 12 | |
| 19 | 2017 | 12 | |
| 20 | 2020 | 11 |
About Fa Xing
Fa Xing is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials, Computational Mechanics and Mechanical Engineering, having authored 56 papers that have together received 790 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (15 papers), Rock Mechanics and Modeling (1 paper), Copper Interconnects and Reliability (1 paper), Metal and Thin Film Mechanics (1 paper), Laser Material Processing Techniques (1 paper) and Heat Transfer and Optimization (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (753 citations), General Materials Science (4 citations), Electronic, Optical and Magnetic Materials (10 citations), Safety, Risk, Reliability and Quality (6 citations) and Mechanical Engineering (21 citations). Fa Xing has collaborated with scholars based in Singapore, United States and Malaysia. Frequent co-authors include Irfan Anjum Badruddin Magami, Mohd Faizul Mohd Sabri, Dhafer Abdulameer Shnawah, Suhana Mohd Said, Masaya Kawano, John H L Pang, Xiaowu Zhang, Hong Miao Ji, Hong Yu Li and Jong‐Kai Lin. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, Journal of Electronic Materials, Microelectronics Reliability and Journal of Materials Science Materials in Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.