Fa Xing
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Mechanical Engineering top 2%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 133
- 3D IC and TSV technologies 102
- Integrated Circuits and Semiconductor Failure Analysis 17
- Electromagnetic Compatibility and Noise Suppression 13
-
- Advanced Welding Techniques Analysis 21
- Aluminum Alloys Composites Properties 14
- Co-authors
- J.H.L. Pang (37 shared papers)Xiaowu Zhang (22 shared papers)Irfan Anjum Badruddin (9 shared papers)Mohd Faizul Mohd Sabri (9 shared papers)Dhafer Abdulameer Shnawah (8 shared papers)Suhana Mohd Said (8 shared papers)David Ho (7 shared papers)Wenhui Zhu (6 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (11 papers)Microelectronics Reliability (8 papers)Journal of Electronic Materials (7 papers)IEEE Transactions on Device and Materials Reliability (6 papers)Journal of Alloys and Compounds (2 papers)
- Partner nations
- SingaporeUnited StatesMalaysia
In The Last Decade
Fa Xing
146 papers receiving 2.6k citations
Peers
Comparison fields: 5 of 56
- Electrical and Electronic Engineering 2.5k
- Mechanical Engineering 1.1k
- Mechanics of Materials 459
- General Materials Science 52
- Automotive Engineering 141
Countries citing papers authored by Fa Xing
This map shows the geographic impact of Fa Xing's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fa Xing with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fa Xing more than expected).
Fields of papers citing papers by Fa Xing
This network shows the impact of papers produced by Fa Xing. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fa Xing. The network helps show where Fa Xing may publish in the future.
Co-authors
The 25 scholars most cited alongside Fa Xing, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 153 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 134 | |
| 2 | 2012 | 134 | |
| 3 | 2005 | 130 | |
| 4 | 2012 | 94 | |
| 5 | 2012 | 88 | |
| 6 | 2008 | 86 | |
| 7 | 2012 | 81 | |
| 8 | 2015 | 77 | |
| 9 | 2013 | 76 | |
| 10 | 2009 | 70 | |
| 11 | 2016 | 63 | |
| 12 | 2012 | 60 | |
| 13 | 2012 | 57 | |
| 14 | 2005 | 55 | |
| 15 | 2012 | 54 | |
| 16 | 2013 | 53 | |
| 17 | 2012 | 50 | |
| 18 | 2020 | 43 | |
| 19 | 2005 | 42 | |
| 20 | 2012 | 38 |
About Fa Xing
Fa Xing is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Biomedical Engineering and Aerospace Engineering, having authored 153 papers that have together received 2.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (133 papers), 3D IC and TSV technologies (102 papers), Advanced Welding Techniques Analysis (21 papers), Integrated Circuits and Semiconductor Failure Analysis (17 papers), Aluminum Alloys Composites Properties (14 papers), Electromagnetic Compatibility and Noise Suppression (13 papers), Aluminum Alloy Microstructure Properties (11 papers) and Material Properties and Processing (11 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.5k citations), Mechanical Engineering (1.1k citations), Mechanics of Materials (459 citations), General Materials Science (52 citations) and Automotive Engineering (141 citations). Fa Xing has collaborated with scholars based in Singapore, United States and Malaysia. Frequent co-authors include J.H.L. Pang, Xiaowu Zhang, Irfan Anjum Badruddin, Mohd Faizul Mohd Sabri, Dhafer Abdulameer Shnawah, Suhana Mohd Said, David Ho, Wenhui Zhu, Luhua Xu and B.S. Xiong. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, Journal of Electronic Materials, IEEE Transactions on Device and Materials Reliability and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.