Peter Ramm
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
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- Circadian rhythm and melatonin
Papers in
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- 3D IC and TSV technologies 47
- Electronic Packaging and Soldering Technologies 22
- Semiconductor materials and devices 17
- Advanced MEMS and NEMS Technologies 10
- Semiconductor Lasers and Optical Devices 9
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- Additive Manufacturing and 3D Printing Technologies 14
- Co-authors
- Armin Klumpp (27 shared papers)Barrie J. Frost (4 shared papers)Carlyle T. Smith (1 shared paper)Robert Wieland (13 shared papers)Josef Weber (18 shared papers)Christopher A. Bower (3 shared papers)Philip E. Garrou (4 shared papers)Reinhard Merkel (7 shared papers)
In The Last Decade
Peter Ramm
89 papers receiving 1.9k citations
Peers
Comparison fields: 5 of 127
- Electrical and Electronic Engineering 1.2k
- Endocrine and Autonomic Systems 121
- Cognitive Neuroscience 325
- Cellular and Molecular Neuroscience 291
- Automotive Engineering 184
Countries citing papers authored by Peter Ramm
This map shows the geographic impact of Peter Ramm's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peter Ramm with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peter Ramm more than expected).
Fields of papers citing papers by Peter Ramm
This network shows the impact of papers produced by Peter Ramm. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peter Ramm. The network helps show where Peter Ramm may publish in the future.
Co-authors
The 25 scholars most cited alongside Peter Ramm, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 90 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1990 | 142 | |
| 2 | Handbook of 3D integration : technology and applications of 3D integrated circuits | 2012 | 139 |
| 3 | 2008 | 99 | |
| 4 | 2019 | 86 | |
| 5 | 1987 | 84 | |
| 6 | 1997 | 81 | |
| 7 | 1979 | 70 | |
| 8 | 1986 | 70 | |
| 9 | 2010 | 65 | |
| 10 | 1983 | 64 | |
| 11 | 2004 | 63 | |
| 12 | 1995 | 60 | |
| 13 | 2001 | 56 | |
| 14 | 2006 | 53 | |
| 15 | 2009 | 53 | |
| 16 | 2003 | 46 | |
| 17 | 1999 | 45 | |
| 18 | 2003 | 45 | |
| 19 | 1984 | 42 | |
| 20 | 1996 | 37 |
About Peter Ramm
Peter Ramm is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biophysics, Industrial and Manufacturing Engineering and Electronic, Optical and Magnetic Materials, having authored 90 papers that have together received 2.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (47 papers), Electronic Packaging and Soldering Technologies (22 papers), Semiconductor materials and devices (17 papers), Additive Manufacturing and 3D Printing Technologies (14 papers), Advanced MEMS and NEMS Technologies (10 papers), Semiconductor Lasers and Optical Devices (9 papers), Copper Interconnects and Reliability (7 papers) and Cell Image Analysis Techniques (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.2k citations), Endocrine and Autonomic Systems (121 citations), Cognitive Neuroscience (325 citations), Cellular and Molecular Neuroscience (291 citations) and Automotive Engineering (184 citations). Peter Ramm has collaborated with scholars based in Germany, Canada and Norway. Frequent co-authors include Armin Klumpp, Barrie J. Frost, Carlyle T. Smith, Robert Wieland, Josef Weber, Christopher A. Bower, Philip E. Garrou, Reinhard Merkel, S.A. Kuhn and M.B. Kleiner. Their work appears in journals such as Microelectronic Engineering, Japanese Journal of Applied Physics, Thin Solid Films, Computerized Medical Imaging and Graphics and Current Opinion in Biotechnology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.