Gerd Schlottig
Impact in
- Mechanical Engineering top 5%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 30
- 3D IC and TSV technologies 29
- Nanomaterials and Printing Technologies 10
- Silicon Carbide Semiconductor Technologies 7
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- Mechanical Behavior of Composites 10
- Adhesion, Friction, and Surface Interactions 7
- Co-authors
- Thomas Brunschwiler (38 shared papers)Bruno Michel (6 shared papers)Chander Shekhar Sharma (3 shared papers)Manish K. Tiwari (3 shared papers)Dimos Poulikakos (4 shared papers)Bernhard Wunderle (19 shared papers)Severin Zimmermann (5 shared papers)H. Pape (14 shared papers)
- Journals
- Journal of Electronic Packaging (4 papers)International Journal of Heat and Mass Transfer (1 paper)Applied Energy (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Microelectronics Reliability (1 paper)
- Partner nations
- SwitzerlandGermanyNetherlands
In The Last Decade
Gerd Schlottig
57 papers receiving 683 citations
Peers
Comparison fields: 5 of 39
- Mechanical Engineering 361
- Electrical and Electronic Engineering 378
- Mechanics of Materials 160
- Computational Mechanics 59
- Materials Chemistry 113
Countries citing papers authored by Gerd Schlottig
This map shows the geographic impact of Gerd Schlottig's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gerd Schlottig with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gerd Schlottig more than expected).
Fields of papers citing papers by Gerd Schlottig
This network shows the impact of papers produced by Gerd Schlottig. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gerd Schlottig. The network helps show where Gerd Schlottig may publish in the future.
Co-authors
The 25 scholars most cited alongside Gerd Schlottig, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 58 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 160 | |
| 2 | 2015 | 91 | |
| 3 | 2015 | 33 | |
| 4 | 2010 | 25 | |
| 5 | 2012 | 21 | |
| 6 | 2012 | 20 | |
| 7 | 2016 | 20 | |
| 8 | 2013 | 19 | |
| 9 | 2010 | 18 | |
| 10 | 2010 | 17 | |
| 11 | 2016 | 16 | |
| 12 | 2013 | 15 | |
| 13 | 2016 | 14 | |
| 14 | 2009 | 12 | |
| 15 | 2009 | 11 | |
| 16 | 2009 | 11 | |
| 17 | 2012 | 11 | |
| 18 | 2017 | 11 | |
| 19 | 2014 | 10 | |
| 20 | 2011 | 10 |
About Gerd Schlottig
Gerd Schlottig is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Materials Chemistry and Biomedical Engineering, having authored 58 papers that have together received 693 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (29 papers), Mechanical Behavior of Composites (10 papers), Nanomaterials and Printing Technologies (10 papers), Heat Transfer and Optimization (8 papers), Silicon Carbide Semiconductor Technologies (7 papers), Adhesion, Friction, and Surface Interactions (7 papers) and Thermal properties of materials (6 papers). The work is most often cited by research in Mechanical Engineering (361 citations), Electrical and Electronic Engineering (378 citations), Mechanics of Materials (160 citations), Computational Mechanics (59 citations) and Materials Chemistry (113 citations). Gerd Schlottig has collaborated with scholars based in Switzerland, Germany and Netherlands. Frequent co-authors include Thomas Brunschwiler, Bruno Michel, Chander Shekhar Sharma, Manish K. Tiwari, Dimos Poulikakos, Bernhard Wunderle, Severin Zimmermann, H. Pape, L.J. Ernst and K.M.B. Jansen. Their work appears in journals such as Journal of Electronic Packaging, International Journal of Heat and Mass Transfer, Applied Energy, IEEE Transactions on Components Packaging and Manufacturing Technology and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.