Martin Schneider‐Ramelow

93 papers and 617 indexed citations i.

Martin Schneider‐Ramelow has authored 93 papers that have received a total of 617 indexed citations. This includes 74 papers in Electrical and Electronic Engineering, 28 papers in Mechanical Engineering and 18 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (27 papers) and Advanced Sensor and Energy Harvesting Materials (13 papers). Martin Schneider‐Ramelow is often cited by papers focused on Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (27 papers) and Advanced Sensor and Energy Harvesting Materials (13 papers) and collaborates with scholars based in Germany, United Kingdom and Finland. Martin Schneider‐Ramelow's co-authors include H. Reichl, Klaus‐Dieter Lang, Ha-Duong Ngo, A. Ostmann and R. Aschenbrenner and has published in prestigious journals such as Journal of Applied Physics, Advanced Functional Materials and Resources Conservation and Recycling.