H. Pape
Impact in
- Mechanics of Materials top 5%
- Mechanical Behavior of Composites
- Fatigue and fracture mechanics
- Numerical methods in engineering
-
- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- 3D IC and TSV technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 40
- 3D IC and TSV technologies 10
- Silicon Carbide Semiconductor Technologies 8
- Integrated Circuits and Semiconductor Failure Analysis 6
-
- Mechanical Behavior of Composites 25
- Fatigue and fracture mechanics 11
- Numerical methods in engineering 9
- Ultrasonics and Acoustic Wave Propagation 8
- Co-authors
- Dirk Schweitzer (8 shared papers)Bernhard Wunderle (23 shared papers)L.J. Ernst (22 shared papers)Gerd Schlottig (15 shared papers)K.M.B. Jansen (16 shared papers)G. Kelly (1 shared paper)C. Lyden (1 shared paper)John Barrett (1 shared paper)
- Journals
- International Journal of Adhesion and Adhesives (2 papers)Energy Sources (1 paper)Polymer (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)Microelectronics Reliability (1 paper)
- Partner nations
- GermanyNetherlandsSingapore
In The Last Decade
H. Pape
58 papers receiving 717 citations
Peers
Comparison fields: 5 of 59
- Mechanics of Materials 281
- Electrical and Electronic Engineering 603
- Mechanical Engineering 195
- Condensed Matter Physics 39
- Ceramics and Composites 17
Countries citing papers authored by H. Pape
This map shows the geographic impact of H. Pape's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Pape with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Pape more than expected).
Fields of papers citing papers by H. Pape
This network shows the impact of papers produced by H. Pape. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Pape. The network helps show where H. Pape may publish in the future.
Co-authors
The 25 scholars most cited alongside H. Pape, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 61 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1996 | 83 | |
| 2 | 2008 | 74 | |
| 3 | 2011 | 61 | |
| 4 | 2009 | 38 | |
| 5 | 2012 | 27 | |
| 6 | 2004 | 26 | |
| 7 | 2003 | 25 | |
| 8 | 2010 | 25 | |
| 9 | 2008 | 20 | |
| 10 | 2008 | 19 | |
| 11 | 2008 | 18 | |
| 12 | 1985 | 18 | |
| 13 | 2010 | 18 | |
| 14 | 2010 | 17 | |
| 15 | 2002 | 15 | |
| 16 | 2012 | 15 | |
| 17 | 2012 | 13 | |
| 18 | 2009 | 13 | |
| 19 | 1996 | 12 | |
| 20 | 2009 | 12 |
About H. Pape
H. Pape is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Materials Chemistry and Biomedical Engineering, having authored 61 papers that have together received 754 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (40 papers), Mechanical Behavior of Composites (25 papers), Fatigue and fracture mechanics (11 papers), 3D IC and TSV technologies (10 papers), Numerical methods in engineering (9 papers), Silicon Carbide Semiconductor Technologies (8 papers), Ultrasonics and Acoustic Wave Propagation (8 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). The work is most often cited by research in Mechanics of Materials (281 citations), Electrical and Electronic Engineering (603 citations), Mechanical Engineering (195 citations), Condensed Matter Physics (39 citations) and Ceramics and Composites (17 citations). H. Pape has collaborated with scholars based in Germany, Netherlands and Singapore. Frequent co-authors include Dirk Schweitzer, Bernhard Wunderle, L.J. Ernst, Gerd Schlottig, K.M.B. Jansen, G. Kelly, C. Lyden, John Barrett, B. Michel and York Christian Gerstenmaier. Their work appears in journals such as International Journal of Adhesion and Adhesives, Energy Sources, Polymer, IEEE Transactions on Components and Packaging Technologies and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.