Seungbae Park
Impact in
- Mechanics of Materials top 1%
- Numerical methods in engineering
- Ultrasonics and Acoustic Wave Propagation
- Fatigue and fracture mechanics
- Mechanical Behavior of Composites
- Adhesion, Friction, and Surface Interactions
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 117
- 3D IC and TSV technologies 81
- Integrated Circuits and Semiconductor Failure Analysis 16
- Electrostatic Discharge in Electronics 12
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- Material Properties and Processing 13
- Adhesion, Friction, and Surface Interactions 12
- Mechanical Behavior of Composites 11
- Co-authors
- Soonwan Chung (13 shared papers)Jiefeng Xu (23 shared papers)Ke Pan (24 shared papers)Da Yu (15 shared papers)Huayan Wang (17 shared papers)Dapeng Liu (6 shared papers)Jae B. Kwak (14 shared papers)Yangyang Lai (30 shared papers)
- Journals
- Microelectronics Reliability (16 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (10 papers)Journal of Electronic Packaging (6 papers)Journal of Electronic Materials (4 papers)IEEE Transactions on Components and Packaging Technologies (3 papers)
- Partner nations
- United StatesSouth KoreaChina
In The Last Decade
Seungbae Park
159 papers receiving 2.9k citations
Seungbae Park's Hit Papers
Peers
Comparison fields: 5 of 77
- Mechanics of Materials 1.1k
- Electrical and Electronic Engineering 1.8k
- Industrial and Manufacturing Engineering 188
- Mechanical Engineering 659
- Civil and Structural Engineering 250
Countries citing papers authored by Seungbae Park
This map shows the geographic impact of Seungbae Park's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seungbae Park with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seungbae Park more than expected).
Fields of papers citing papers by Seungbae Park
This network shows the impact of papers produced by Seungbae Park. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seungbae Park. The network helps show where Seungbae Park may publish in the future.
Co-authors
The 25 scholars most cited alongside Seungbae Park, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 165 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Fracture Criteria for Piezoelectric Ceramics Hit paper breakdown → | 1995 | 529 |
| 2 | 2010 | 121 | |
| 3 | 2007 | 88 | |
| 4 | 2007 | 88 | |
| 5 | 2021 | 70 | |
| 6 | 2013 | 65 | |
| 7 | 2007 | 65 | |
| 8 | 2014 | 60 | |
| 9 | 2007 | 60 | |
| 10 | 2009 | 59 | |
| 11 | 2008 | 53 | |
| 12 | 2007 | 45 | |
| 13 | 2018 | 44 | |
| 14 | 2007 | 42 | |
| 15 | 2010 | 41 | |
| 16 | 2010 | 37 | |
| 17 | 2018 | 30 | |
| 18 | Fracture behavior of piezoelectric materials | 1994 | 29 |
| 19 | 2008 | 29 | |
| 20 | 2018 | 29 |
About Seungbae Park
Seungbae Park is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Biomedical Engineering and Industrial and Manufacturing Engineering, having authored 165 papers that have together received 3.0k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (117 papers), 3D IC and TSV technologies (81 papers), Integrated Circuits and Semiconductor Failure Analysis (16 papers), Material Properties and Processing (13 papers), Adhesion, Friction, and Surface Interactions (12 papers), Electrostatic Discharge in Electronics (12 papers), Mechanical Behavior of Composites (11 papers) and Metal Forming Simulation Techniques (11 papers). The work is most often cited by research in Mechanics of Materials (1.1k citations), Electrical and Electronic Engineering (1.8k citations), Industrial and Manufacturing Engineering (188 citations), Mechanical Engineering (659 citations) and Civil and Structural Engineering (250 citations). Seungbae Park has collaborated with scholars based in United States, South Korea and China. Frequent co-authors include Soonwan Chung, Jiefeng Xu, Ke Pan, Da Yu, Huayan Wang, Dapeng Liu, Jae B. Kwak, Yangyang Lai, Yuling Niu and Jing Wang. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging, Journal of Electronic Materials and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.