Patrick W. DeHaven
About
Patrick W. DeHaven has authored 28 papers that have received a total of 343 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (12 papers), Electronic Packaging and Soldering Technologies (8 papers) and Metal and Thin Film Mechanics (6 papers). Patrick W. DeHaven is often cited by papers focused on Copper Interconnects and Reliability (12 papers), Electronic Packaging and Soldering Technologies (8 papers) and Metal and Thin Film Mechanics (6 papers) and collaborates with scholars based in United States, Germany and Switzerland. Patrick W. DeHaven's co-authors include Virgil L. Goedken, O. van der Straten, L. Gignac, James J. Kelly and Juntao Li and has published in prestigious journals such as Journal of the American Chemical Society, The Journal of Chemical Physics and Journal of Applied Physics.
In The Last Decade
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