Patrick W. DeHaven
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Perovskite Materials and Applications
Papers in
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- Electronic Packaging and Soldering Technologies 11
- Semiconductor materials and devices 9
- 3D IC and TSV technologies 5
- Electrodeposition and Electroless Coatings 4
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- Copper Interconnects and Reliability 13
- Co-authors
- Frank P. Buff (1 shared paper)Ronald Lovett (1 shared paper)Virgil L. Goedken (3 shared papers)David R. Medeiros (1 shared paper)David B. Mitzi (1 shared paper)Kenneth P. Rodbell (3 shared papers)Marvin C. Weiss (1 shared paper)Philip Warner (2 shared papers)
- Journals
- Journal of the American Chemical Society (2 papers)The Journal of Chemical Physics (1 paper)IBM Journal of Research and Development (1 paper)Tetrahedron Letters (1 paper)Chemistry of Materials (1 paper)
- Partner nations
- United StatesGermanySwitzerland
In The Last Decade
Patrick W. DeHaven
31 papers receiving 395 citations
Peers
Comparison fields: 5 of 53
- Electronic, Optical and Magnetic Materials 97
- Electrical and Electronic Engineering 200
- Statistical and Nonlinear Physics 43
- Materials Chemistry 134
- Physical and Theoretical Chemistry 25
Countries citing papers authored by Patrick W. DeHaven
This map shows the geographic impact of Patrick W. DeHaven's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick W. DeHaven with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick W. DeHaven more than expected).
Fields of papers citing papers by Patrick W. DeHaven
This network shows the impact of papers produced by Patrick W. DeHaven. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick W. DeHaven. The network helps show where Patrick W. DeHaven may publish in the future.
Co-authors
The 25 scholars most cited alongside Patrick W. DeHaven, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1973 | 104 | |
| 2 | 2002 | 59 | |
| 3 | 1979 | 30 | |
| 4 | 1978 | 22 | |
| 5 | 1998 | 20 | |
| 6 | 1995 | 19 | |
| 7 | 1995 | 19 | |
| 8 | 2013 | 18 | |
| 9 | 1977 | 17 | |
| 10 | 2012 | 16 | |
| 11 | 1991 | 15 | |
| 12 | 1984 | 14 | |
| 13 | 1996 | 9 | |
| 14 | 2011 | 7 | |
| 15 | 2011 | 7 | |
| 16 | 1979 | 6 | |
| 17 | 1984 | 5 | |
| 18 | 2003 | 5 | |
| 19 | 2010 | 4 | |
| 20 | 1994 | 4 |
About Patrick W. DeHaven
Patrick W. DeHaven is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Materials Chemistry and Mechanical Engineering, having authored 34 papers that have together received 427 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (13 papers), Electronic Packaging and Soldering Technologies (11 papers), Semiconductor materials and devices (9 papers), Metal and Thin Film Mechanics (6 papers), 3D IC and TSV technologies (5 papers), Electrodeposition and Electroless Coatings (4 papers), Semiconductor materials and interfaces (3 papers) and Anodic Oxide Films and Nanostructures (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (97 citations), Electrical and Electronic Engineering (200 citations), Statistical and Nonlinear Physics (43 citations), Materials Chemistry (134 citations) and Physical and Theoretical Chemistry (25 citations). Patrick W. DeHaven has collaborated with scholars based in United States, Germany and Switzerland. Frequent co-authors include Frank P. Buff, Ronald Lovett, Virgil L. Goedken, David R. Medeiros, David B. Mitzi, Kenneth P. Rodbell, Marvin C. Weiss, Philip Warner, Robert A. Jacobson and C. C. Goldsmith. Their work appears in journals such as Journal of the American Chemical Society, The Journal of Chemical Physics, IBM Journal of Research and Development, Tetrahedron Letters and Chemistry of Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.