Patrick W. DeHaven
Impact in
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- Copper Interconnects and Reliability
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- Advanced Thermodynamics and Statistical Mechanics
Papers in
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- Electronic Packaging and Soldering Technologies 10
- Semiconductor materials and devices 9
- Electrodeposition and Electroless Coatings 4
- 3D IC and TSV technologies 4
- Advancements in Semiconductor Devices and Circuit Design 3
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- Copper Interconnects and Reliability 13
- Co-authors
- Ronald Lovett (1 shared paper)Frank P. Buff (1 shared paper)Virgil L. Goedken (3 shared papers)David B. Mitzi (1 shared paper)David R. Medeiros (1 shared paper)Kenneth P. Rodbell (3 shared papers)Marvin C. Weiss (1 shared paper)Philip Warner (2 shared papers)
- Journals
- Journal of the American Chemical Society (2 papers)Tetrahedron Letters (1 paper)Chemistry of Materials (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)IBM Journal of Research and Development (1 paper)
- Partner nations
- United StatesGermanySwitzerland
In The Last Decade
Patrick W. DeHaven
31 papers receiving 368 citations
Peers
Comparison fields: 5 of 52
- Electronic, Optical and Magnetic Materials 84
- Statistical and Nonlinear Physics 40
- Electrical and Electronic Engineering 177
- Materials Chemistry 131
- Atomic and Molecular Physics, and Optics 80
Countries citing papers authored by Patrick W. DeHaven
This map shows the geographic impact of Patrick W. DeHaven's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick W. DeHaven with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick W. DeHaven more than expected).
Fields of papers citing papers by Patrick W. DeHaven
This network shows the impact of papers produced by Patrick W. DeHaven. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick W. DeHaven. The network helps show where Patrick W. DeHaven may publish in the future.
Co-authors
The 25 scholars most cited alongside Patrick W. DeHaven, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 33 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1973 | 98 | |
| 2 | 2002 | 56 | |
| 3 | 1979 | 29 | |
| 4 | 1978 | 22 | |
| 5 | 1998 | 20 | |
| 6 | 1995 | 18 | |
| 7 | 1995 | 18 | |
| 8 | 2012 | 15 | |
| 9 | 1991 | 15 | |
| 10 | 1977 | 14 | |
| 11 | 1984 | 12 | |
| 12 | 2013 | 12 | |
| 13 | 1996 | 8 | |
| 14 | 2011 | 7 | |
| 15 | 2011 | 6 | |
| 16 | 1979 | 6 | |
| 17 | 2003 | 5 | |
| 18 | 1993 | 3 | |
| 19 | 1984 | 3 | |
| 20 | 1994 | 3 |
About Patrick W. DeHaven
Patrick W. DeHaven is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Materials Chemistry and Mechanical Engineering, having authored 33 papers that have together received 391 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (13 papers), Electronic Packaging and Soldering Technologies (10 papers), Semiconductor materials and devices (9 papers), Metal and Thin Film Mechanics (6 papers), Electrodeposition and Electroless Coatings (4 papers), 3D IC and TSV technologies (4 papers), Anodic Oxide Films and Nanostructures (3 papers) and Advancements in Semiconductor Devices and Circuit Design (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (84 citations), Statistical and Nonlinear Physics (40 citations), Electrical and Electronic Engineering (177 citations), Materials Chemistry (131 citations) and Atomic and Molecular Physics, and Optics (80 citations). Patrick W. DeHaven has collaborated with scholars based in United States, Germany and Switzerland. Frequent co-authors include Ronald Lovett, Frank P. Buff, Virgil L. Goedken, David B. Mitzi, David R. Medeiros, Kenneth P. Rodbell, Marvin C. Weiss, Philip Warner, Robert A. Jacobson and L. A. Clevenger. Their work appears in journals such as Journal of the American Chemical Society, Tetrahedron Letters, Chemistry of Materials, Journal of materials research/Pratt's guide to venture capital sources and IBM Journal of Research and Development.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.