T. Bolom
Impact in
- Mechanics of Materials top 2%
- Metal and Thin Film Mechanics
- Ceramics and Composites top 10%
- Advanced ceramic materials synthesis
Papers in
-
- Semiconductor materials and devices 10
- Electronic Packaging and Soldering Technologies 2
-
- Copper Interconnects and Reliability 8
- Co-authors
- K. Moto (4 shared papers)Pavel Nesládek (3 shared papers)S. Vepřek (3 shared papers)H.-D. Männling (2 shared papers)A. Bergmaier (1 shared paper)G. Dollinger (1 shared paper)D. S. Patil (1 shared paper)C. Eggs (1 shared paper)
- Journals
- Surface and Coatings Technology (2 papers)Thin Solid Films (2 papers)Applied Physics Letters (1 paper)Japanese Journal of Applied Physics (1 paper)ECS Transactions (1 paper)
- Partner nations
- United StatesGermanySwitzerland
In The Last Decade
T. Bolom
14 papers receiving 625 citations
Peers
Comparison fields: 5 of 39
- Mechanics of Materials 501
- Ceramics and Composites 72
- Materials Chemistry 521
- Mechanical Engineering 174
- Electronic, Optical and Magnetic Materials 72
Countries citing papers authored by T. Bolom
This map shows the geographic impact of T. Bolom's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Bolom with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Bolom more than expected).
Fields of papers citing papers by T. Bolom
This network shows the impact of papers produced by T. Bolom. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Bolom. The network helps show where T. Bolom may publish in the future.
Co-authors
The 25 scholars most cited alongside T. Bolom, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 364 | |
| 2 | 2001 | 120 | |
| 3 | 2000 | 41 | |
| 4 | 2013 | 31 | |
| 5 | 1996 | 27 | |
| 6 | 1999 | 25 | |
| 7 | 2004 | 13 | |
| 8 | 2005 | 11 | |
| 9 | 2007 | 11 | |
| 10 | 2014 | 11 | |
| 11 | 2003 | 4 | |
| 12 | 2013 | 3 | |
| 13 | 2005 | 2 | |
| 14 | 2010 | 1 | |
| 15 | 2008 | 1 |
About T. Bolom
T. Bolom is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Materials Chemistry and Atomic and Molecular Physics, and Optics, having authored 15 papers that have together received 665 indexed citations. Recurring topics across this work include Semiconductor materials and devices (10 papers), Copper Interconnects and Reliability (8 papers), Metal and Thin Film Mechanics (7 papers), Diamond and Carbon-based Materials Research (3 papers), Semiconductor materials and interfaces (2 papers), Boron and Carbon Nanomaterials Research (2 papers), Electronic Packaging and Soldering Technologies (2 papers) and Nanowire Synthesis and Applications (1 paper). The work is most often cited by research in Mechanics of Materials (501 citations), Ceramics and Composites (72 citations), Materials Chemistry (521 citations), Mechanical Engineering (174 citations) and Electronic, Optical and Magnetic Materials (72 citations). T. Bolom has collaborated with scholars based in United States, Germany and Switzerland. Frequent co-authors include K. Moto, Pavel Nesládek, S. Vepřek, H.-D. Männling, A. Bergmaier, G. Dollinger, D. S. Patil, C. Eggs, Motomu Tanaka and R. A. Deutschmann. Their work appears in journals such as Surface and Coatings Technology, Thin Solid Films, Applied Physics Letters, Japanese Journal of Applied Physics and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.